Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A 10-micron-level high-precision device assembly surface inspection method

A surface inspection and device surface technology, applied in the field of virtual assembly, can solve the problems of increased algorithm estimation time, large number of iterations, etc.

Active Publication Date: 2021-08-10
NORTH CHINA UNIVERSITY OF TECHNOLOGY
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the algorithm can be robustly estimated, when the proportion of inliers in the data to be tested is too small, a large number of iterations is required, which makes the algorithm estimation time increase sharply
Moreover, the random sampling consensus algorithm estimates the quality of the model according to the number of internal points, which often makes the model farther away from the high-density point cloud

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A 10-micron-level high-precision device assembly surface inspection method
  • A 10-micron-level high-precision device assembly surface inspection method
  • A 10-micron-level high-precision device assembly surface inspection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The present invention will be described in detail below in conjunction with the implementations shown in the drawings, but it should be noted that these implementations are not limitations of the present invention, and those of ordinary skill in the art based on the functions, methods, or structural changes made by these implementations Equivalent transformations or substitutions all fall within the protection scope of the present invention.

[0033] For the assembly model reconstructed from the 3D point cloud in the virtual assembly environment, the surface of the assembleable device will be partially deformed (convex). When the size of the assembled device is appropriate, these deformed areas will lead to assembly failure. Location. The main function of this method is to find the highest convex distance from the assembly surface. This method divides the point cloud data into two sets, one is the set of internal points, and the other is the set of external points, usi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a 10-micron-level high-precision device assembly surface detection method, which is characterized by comprising the following steps: Step 1, calculating a device surface estimation model m i ; Step 2, calculate all points in the point cloud data to the estimated model m i distance d; step 3, specify the threshold t, and use the point that satisfies d<t as the intra-office point; step 4, set the estimated model m i Evaluate and get an evaluation score. If the evaluation score is the highest, the current prediction model m i is the best estimation model; step 5, repeat steps 2 to 4, when the number of iterations increases to k, obtain the best model m; step 6, divide the outliers into several point sets based on the clustering segmentation algorithm; step 7 , according to the position of the point set and the positional relationship of the surface to determine the concavity and convexity of the position of the point set, and obtain the maximum surface error of each surface. The invention can accurately and quickly reflect the convexity and concave condition of the assembly surface, and provides convenience for the subsequent device matching determination work.

Description

technical field [0001] The invention belongs to the technical field of virtual assembly, and in particular relates to a method for detecting assembly surfaces of 10-micron-level high-precision devices. Background technique [0002] At present, most virtual assembly systems are based on the assembly constraints of the device, ignoring the fit of the assembly surface, resulting in a large difference between the virtual assembly and the actual assembly process. However, based on the physical properties of the assembly system, dynamic simulation requires a lot of calculations, which is inefficient. [0003] The first thing to do to extract the surface feature information of the assembly object is to segment the data set, that is, to segment the surface point cloud and the non-planar point cloud, and then analyze the unevenness of each surface. At present, there are a large number of surface detection and point cloud segmentation algorithms. According to their working principles...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/60G06T7/64G06T7/10G06K9/62
CPCG06T7/60G06T7/64G06T7/10G06T2207/10028G06T2207/30164G06F18/23G06F18/24
Inventor 马礼张纯新马东超傅颖勋张永梅
Owner NORTH CHINA UNIVERSITY OF TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products