Light segmentation method, laser-based cutting method, equipment and system

Abstract

The invention provides a light segmentation method, a laser-based cutting method, equipment and system. The method comprises the following steps that incident linearly polarized light is acquired; incident linearly polarized light is controlled to be incident to a first wave plate to obtain emergent linearly polarized light; and the emergent linearly polarized light is controlled to be incident toa first polarization beam splitter, and first target light and second target light are obtained by decomposing the emergent linearly polarized light on the basis of the first polarization beam splitter, wherein the amplitude of the first target light is the product of the amplitude of the emergent linearly polarized light and the cosine of a third included angle, the amplitude of the second target light is the product of the amplitude of the emergent linearly polarized light and the sine of a third included angle, and the third included angle is the included angle between the light vector ofthe emergent linearly polarized light and the first target light. According to the light segmentation method, the problem that the light loss or insecurity is caused by an adopted passive shielding mode due to the fact that light path output light energy is inconsistent and can not flexibly control the independent switches of a plurality light paths due to the fact that a film layer of a light splitter is difficult to achieve standard proportion light splitting in the prior art is solved.

Description

technical field [0001] The invention relates to the field of light cutting, in particular to a light cutting method, a laser-based cutting method, equipment and a system. Background technique [0002] Laser cutting is generally widely used in the panel cutting industry. Due to the low power required for process processing and the high price of lasers, the laser is divided by the principle of light splitting to cut the panel according to the divided light. Generally, the schematic diagram of the equipment for cutting by laser is as follows: figure 1 As shown, it may include a laser, a beam splitter, a beam expander, a galvanometer, a field lens, and a stage. And this equipment usually utilizes a half-transparent mirror (that is, a beam splitter) to split the laser light, such as figure 2 As shown, the surface of fused silica is coated with a semi-transparent and semi-reflective film layer, which splits light through the surface coating, the incident angle is 45 degrees, an...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a light splitting method, a laser-based cutting method, equipment and system to solve the problem in the prior art that the output light energy of the optical path is inconsistent due to the difficulty of standard ratio splitting by the film layer of the beam splitter

Images