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A kind of testing method of fragment chip

A testing method and chip technology, which is applied in the direction of electronic circuit testing, measuring electronics, measuring devices, etc., can solve the problems of long cycle, heavy wiring workload, and low wiring success rate, so as to improve production capacity, improve testing efficiency, The effect of improving the test success rate

Active Publication Date: 2022-01-14
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a testing method for fragmented chips, which is used to solve the problem of huge wiring workload, low wiring success rate and long cycle in the testing of fragmented chips in the prior art. question

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  • A kind of testing method of fragment chip
  • A kind of testing method of fragment chip
  • A kind of testing method of fragment chip

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Embodiment Construction

[0018] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0019] see Figure 1 to Figure 4 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily ...

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Abstract

The present invention provides a method for testing fragmented chips, comprising: step 1, providing fragmented chips and a complete wafer, wherein the complete wafer is provided with chips of the same type as the fragmented chips; step 2, placing the fragmented chips Paste it on the complete wafer at the position where the chip of the same type is located; step 3, provide a test machine; step 4, transfer the complete wafer pasted with the fragment chip in step 2 to the test The machine is tested. The method for testing fragmented chips of the present invention can effectively improve test efficiency, increase production capacity, and improve test success rate at the same time.

Description

technical field [0001] The invention relates to the field of wafer testing, in particular to a testing method for chip chips. Background technique [0002] Wafer testing (Circuit Probing, CP), also known as circuit needle testing, is to test the chip die (die) directly on the wafer (wafer) before packaging to verify whether each chip meets the product specifications. At present, in wafer chip testing, if fragmented samples need to be tested, the usual method requires wire bonding and packaging before testing. However, this method is currently limited by its packaging and wiring resources, and it usually takes about one day faster; for products with many IP pads, the success rate of wiring also decreases; for products with many IP pads, the connection The line that matches the package pins is particularly heavy workload. And at the same time, the cycle is long and depends on multiple resources. Therefore, the production capacity of the product is reduced. [0003] Therefo...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2831G01R31/2893
Inventor 张庆文张雨田
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP