Base board module
A substrate module and grounding conductor technology, which is applied in the field of substrate modules, can solve problems such as the degradation of transmission characteristics, and achieve the effect of high transmission characteristics
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Embodiment approach 1
[0023] figure 1 It is a perspective view showing the substrate module 1 according to Embodiment 1 of the present invention. in addition, figure 2 It is an exploded perspective view showing the substrate module 1 , showing a state where the coaxial connector 2 is detached from the printed circuit board 3 . Substrate module 1 such as figure 1 As shown, there is a coaxial connector 2 and a printed circuit board 3 . The coaxial connector 2 has a first ground conductor portion 20 , a second ground conductor portion 21 , and a core wire 22 . The printed circuit board 3 has a conductor removal region 30 , a wiring region 31 , a signal wiring 32 , a substrate ground 33 , a ground pad 34 , and a signal pad 35 .
[0024] In the coaxial connector 2 , the first ground conductor portion 20 is a cylindrical conductor member in which the core wire 22 is arranged, and is electrically connected to a shield member (not shown) of the coaxial cable to be at ground potential. The shielding p...
Embodiment approach 2
[0050] Figure 7 It is a cross-sectional view showing the substrate module 1A according to Embodiment 2 of the present invention, and shows a cross section of the substrate module 1A cut along the axial direction. base module 1A as Figure 7 As shown, there is a coaxial connector 2A and a printed circuit board 3 .
[0051] The coaxial connector 2A has a structure in which the core wire 22 is surrounded by a conductor member composed of the first ground conductor part 20 and the second ground conductor part 21 as in the first embodiment, but is provided inside the second ground conductor part 21. There is a first dielectric part 23 .
[0052] The first dielectric part 23 such as Figure 7 As shown, it is composed of dielectric bodies 230 to 232 having different relative permittivity from each other. The dielectric body 230 has the smallest relative permittivity, and the dielectric body 231 has the largest relative permittivity. In addition, the dielectric body 232 has a re...
Embodiment approach 3
[0063] Figure 8 It is a cross-sectional view showing the substrate module 1B according to Embodiment 3 of the present invention, and shows a cross section of the substrate module 1B cut along the axial direction. base module 1B as Figure 8 As shown, there is a coaxial connector 2B and a printed circuit board 3 .
[0064] The coaxial connector 2B has a structure in which the core wire 22 is surrounded by a conductor member composed of the first ground conductor part 20 and the second ground conductor part 21 as in the first embodiment, but is provided inside the first ground conductor part 20 There is a second dielectric part 24 .
[0065] The second dielectric part 24 such as Figure 8 As shown, it is composed of dielectric bodies 240 to 242 having different relative permittivity from each other. The dielectric body 240 has the smallest relative permittivity, and the dielectric body 241 has the largest relative permittivity. In addition, the dielectric body 242 has a re...
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