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Positioning structure of grinding pad, grinding equipment and positioning method

A technology for positioning structures and grinding pads, which is applied in the direction of grinding/polishing equipment, grinding devices, grinding machine tools, etc., can solve problems such as the positioning of grinding pads, achieve the effects of reducing waste, reducing production costs, and ensuring processing uniformity

Active Publication Date: 2019-11-01
XIAN ESWIN SILICON WAFER TECH CO LTD
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Problems solved by technology

[0003] The embodiment of the present invention provides a positioning structure of a polishing pad, a polishing device and a positioning method, so as to solve the positioning problem of the polishing pad during the replacement process of the polishing pad

Method used

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  • Positioning structure of grinding pad, grinding equipment and positioning method
  • Positioning structure of grinding pad, grinding equipment and positioning method
  • Positioning structure of grinding pad, grinding equipment and positioning method

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Embodiment Construction

[0044] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0045] The terms "first", "second" and the like in the description and claims of the present invention are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of practice in sequences other than those illustrated or described herein.

[0046] The embodiment of the present invention provides a positioning structure of a grinding pad. The positioning structure 1 is a tool for quickly finding the center point and assisting in sticking the grinding pad. Perform positioning, and then align the centers of the grinding pad 3 a...

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Abstract

The invention provides a positioning structure of a grinding pad, grinding equipment and a positioning method. The positioning structure of the grinding pad comprises a first component and a second component, wherein the first component is provided with a fixing structure and is used for detachably fixing the first component on a grinding disc; and the second component is connected with the firstcomponent, the side, which is close to the first component, of the part of the first component is an arc surface, and the circle center of the arc surface coincides with the circle center of the grinding disc. In this way, the grinding pad can be completely overlapped with the circle center of the grinding disc, so that the processing uniformity of a grinding part is guaranteed, and the same technological output result is ensured after the grinding pad is replaced every time, and meanwhile the waste of the grinding pad can be reduced, and the production cost can be reduced.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing or the field of final polishing of silicon wafers, in particular to a positioning structure of a polishing pad, a polishing device and a positioning method. Background technique [0002] During the replacement process of the grinding pad, the operator needs to paste the grinding pad with a diameter of 830mm on the grinding disc with a diameter of 800mm, and it is necessary to ensure that the centers of the grinding disc and the grinding pad coincide (such as figure 1 shown). However, in the actual operation process, the operator cannot ensure that the centers of the grinding pad and the grinding disc coincide without using auxiliary tools, and eccentric phenomena often occur (such as figure 2 shown). Since there are grooves concentric with the grinding disc on the grinding pad, these grooves are mainly used for dredging the grinding fluid. Due to the eccentricity of the grinding pad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/11B24B37/34B24B53/017
CPCB24B37/11B24B37/34B24B53/017
Inventor 王建新
Owner XIAN ESWIN SILICON WAFER TECH CO LTD
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