High-strength modular case and dustproof device thereof

A dust-proof device, high-strength technology, applied in the direction of pollution prevention methods, chemical instruments and methods, instruments, etc., can solve the problems of using small-gu discounts, without changing the detachable characteristics, etc., and achieve high dust-proof and high-strength Effect

Inactive Publication Date: 2019-11-15
LIUZHOU LIANHAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the most inconspicuous chassis with the most basic functions, it needs to continuously meet the current customer needs. For example, the current chassis generally support motherboards of various specifications, radiators of various forms, and various Various components in various positions, but all the time, it still has not changed its own detachable characteristics, which greatly reduces the use of various components.

Method used

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  • High-strength modular case and dustproof device thereof
  • High-strength modular case and dustproof device thereof
  • High-strength modular case and dustproof device thereof

Examples

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Embodiment Construction

[0024] Aiming at the above-mentioned deficiencies, the present invention provides a telescopic roadblock. The present invention is achieved through the following technical solutions:

[0025] A high-strength modular chassis and its dust-proof device, including a chassis main body 1, a heat dissipation port 4, a protrusion inside the chassis, a cooling fan fixing device, a power supply fixing device, a hard disk fixing device, a motherboard fixing device, a dust-proof net and an anti-dust net. Dust cover 5, the top and side of the main body of the machine are provided with cooling outlets 4, and the interior of the chassis is provided with a plurality of chassis interior protrusions, and the plurality of chassis interior protrusions are connected to cooling fan fixing devices, power supply fixing devices, hard disks, etc. Fixing device, motherboard fixing device, a part of the heat dissipation port 4 is provided with a dust-proof net, and the side of the chassis main body 1 is ...

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PUM

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Abstract

The invention discloses a high-strength modular case and a dustproof device thereof. The high-strength modular case comprises a case main body, heat dissipation openings, a case internal bulges, a heat dissipation fan fixing device, a power supply fixing device, a hard disk fixing device, a mainboard fixing device, a dustproof net and a dustproof cover; the heat dissipation openings are formed inthe top and the side face of the machine body, the plurality of case internal bulges are arranged in the case and connected with the heat dissipation fan fixing device, the power source fixing device,the hard disk fixing device and the mainboard fixing device; a dustproof net is arranged on one part of each heat dissipation opening, and a dustproof cover is further arranged on the side face of the case main body. A high-degree-of-freedom spatial relationship of parts in the case can be realized.

Description

technical field [0001] The invention relates to a high-strength modular case and a dustproof device thereof, belonging to the field of computer equipment. Background technique [0002] At present, since the computer appeared in the form of PC, it can be regarded as a modular product. As the most inconspicuous chassis with the most basic functions, it needs to continuously meet the current customer needs. For example, the current chassis generally support motherboards of various specifications, radiators of various forms, and various Various components in various positions, but for a long time, it still has not changed its own detachable characteristics, which greatly reduces various uses. [0003] To solve this problem, the first problem to be solved is the movement of the main board. As we all know, the main board, as the most fundamental component, is generally fixed on the stud by screws and cannot be moved. But many times, users need to move the main board Mobile, this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18B08B17/02
CPCB08B17/02G06F1/181G06F1/183
Inventor 叶欣
Owner LIUZHOU LIANHAI TECH
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