A method for laying out a pair of stamping dies for power devices
A technology for stamping dies and power devices, which is applied in the field of layout of double-strip stamping dies for power devices, can solve the problems of uneven material strips, shortened service life of power devices, and slumped angles, so as to avoid serious overflow and reduce tread angles. , the effect of reducing the intensity
Active Publication Date: 2020-10-30
SICHUAN JINWAN ELECTRONICS
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Problems solved by technology
However, the existing power device strips are prone to problems such as unevenness, collapse, and poor finish during the stamping process, which affects the stability of the power device's plastic packaging and use, and greatly reduces the service life of the power device. , so it is necessary to solve the problems of unevenness, collapse angle and poor precision of the power device strip
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[0029] The present invention will be described in further detail below through specific implementation examples and in conjunction with the accompanying drawings.
[0030] figure 1 It shows a power device double-strip stamping die layout method provided by the present invention, which specifically includes the following steps:
[0031] S1: Select the appropriate metal strip according to the product prefabricated parts to be prepared, punch out the punching hole 1 on the metal strip through the punching die, and pre-puncher the positioning hole 1 and the slit square hole at the same time ;Punch the rubber hole 1 immediately after the metal strip enters the punching die, effectively avoiding the conflict of the metal strip in the subsequent processing of high-precision stations, so that the metal strip is more accurate in the subsequent processing process; at the same time After the metal strip enters the punching die, punch the positioning hole 1 immediately, so that the metal...
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The invention discloses a method for laying out a pair of stamping dies for a power device, which relates to the field of semiconductor manufacturing technology, and specifically includes the following steps: S1: Select a suitable metal material strip according to the required prefabricated product, and pass it through the punching die Punch out the glue hole on the metal strip, and simultaneously carry out pre-punching to positioning hole one, the slitting square hole; S2: on the basis of step S1, carry out on the metal strip with the blanking mold Hole, heat sink 1, heat sink 2, and inner lead 1 are pre-punched; S3: On the basis of step S2, stamping dovetail 1 and dovetail 2 on the metal strip with a punching die. The invention not only makes the power device strip more smooth during the stamping process, but also effectively prevents the power device strip from slumping during the stamping process, so that the stamped and formed power device strip has higher precision, and the final processing and forming of the power device has a higher precision. Better quality and longer service life.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing technology, in particular to a layout method for a double-strip stamping die of a power device. Background technique [0002] Power devices are the basic electronic components for energy control and conversion in power electronic systems. The continuous development of power electronics technology has opened up a wide range of application fields for semiconductor power, and the controllable characteristics of semiconductor power devices determine the efficiency and volume of power electronic systems. and weight, the first common thyristor for industrial use was developed by General Electric Company of the United States in 1957, which marked the birth of modern power electronics technology. field. Since the birth of vertical double-diffused transistor power devices, electronic power has developed rapidly. Due to its unique characteristics of high input impedance, low driving power, high s...
Claims
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IPC IPC(8): B21D37/08B21D35/00H01L23/28
CPCB21D35/001B21D35/003B21D37/08H01L23/28
Inventor 王锋涛黄斌谢锐周开友宋佳骏黄重钦
Owner SICHUAN JINWAN ELECTRONICS