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Headset with refrigeration function

A headphone and functional technology, which is applied in the field of headphones with cooling function, can solve the problems of prolonged wearable time and high wearing comfort of the headphone, so as to extend the wearable time, reduce injuries, and guarantee The effect of service life

Pending Publication Date: 2019-11-22
得胜电子科技(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The headphone of the present invention has a cooling function, which can effectively solve the problem of heating or sweating in the auricle during wearing the headphone, and avoids the heat or sweating caused by wearing the headphone and causing serious damage to the wearer. The impact of concentration, and reduce the damage to the human ear, high wearing comfort, while prolonging the wearable time of the headset, very humanized and personalized

Method used

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  • Headset with refrigeration function
  • Headset with refrigeration function
  • Headset with refrigeration function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] see Figure 1~Figure 3 Shown is the headphone with cooling function of this embodiment. The headphone includes a headphone rear shell 1 , a speaker assembly 2 , earmuffs 3 , a circuit board 4 and a cooling assembly 5 .

[0038] Wherein, the earmuffs 3 are connected to the earphone rear shell 1, and when worn, the earmuffs 3 are in direct contact with the auricle of the human body. The edge of the earphone rear case 1 extends vertically toward the direction of the earmuffs 3 , so that the earphone rear case 1 forms a non-closed accommodating chamber. Both the speaker assembly 2 and the circuit board 4 are disposed in the cavity formed by the earphone rear shell 1 , and the sound output direction of the speaker assembly 2 faces the earmuff 3 . Moreover, the speaker assembly 2 is connected to the circuit board 4 .

[0039] Moreover, an audio output port 101 and a head-mounted coupling hole 102 are also provided on the earphone rear case 1 . Through the audio output por...

Embodiment 2

[0052] This embodiment is the same as Embodiment 1, the difference is that, further, see Figure 4 As shown, the extension portion of the cold guide plate 52 is filled with a first cold storage body 521 .

[0053] The first cold storage body 521 is filled in the extension part 5202 of the cold guide plate. During the heat conduction process of the cold guide plate 52 to the cold source from the cooling chip 51, after the cold source is conducted from the cooling chip 51 to the cold guide plate body 5201, it is then The cold guide plate body 5201 is conducted to the cold guide plate extension 5202 . When the cold source conducts to the cold guide plate extension 5202, the first cold storage body 521 in the cold guide plate extension 5202 can absorb and store the cold source conducted to the cold guide plate extension 5202, without leaving The cold source is quickly transmitted to the earmuffs 3, so that the cooling process of the earmuffs 3 can be changed slowly, without causi...

Embodiment 3

[0056] This embodiment is the same as embodiment 1 or embodiment 2, further, see Figure 5~Figure 7 As shown, a cooling fan 54 is provided on a side of the radiator 53 away from the cooling chip 51 . The cooling fan 54 is a miniature cooling fan, which can be conveniently accommodated in the earphone. The cooling fan 54 can suck and discharge the heat-enriched air around the radiator 53, so as to prevent the ambient temperature of the radiator 53 from being too high and affect the working efficiency of the radiator 53, thereby indirectly ensuring the working efficiency of the cooling chip 51.

[0057] In this embodiment, the cooling fan 54 is connected to the circuit board 4 , the circuit board 4 has a power supply circuit for the cooling fan 54 , and the cooling fan 54 supplies power through the circuit board 4 .

[0058] Moreover, specifically, the heat dissipation fan 54 and the heat sink 53 are fixedly installed on the cold guide plate 52 through cooperation of screws and...

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PUM

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Abstract

The invention discloses a headset with a refrigeration function. The headset comprises a headset rear shell (1), a loudspeaker assembly (2), earmuffs (3), a circuit board (4) and a refrigeration assembly (5), the earmuffs (3) are connected to the headset rear shell (1); wherein the headset rear shell (1) forms an accommodating cavity, the loudspeaker assembly (2) and the circuit board (4) are botharranged in the accommodating cavity formed by the earphone rear shell (1), and the sounding direction of the loudspeaker assembly (2) faces the earmuffs (3); the horn assembly (2) is connected withthe circuit board (4); and the refrigeration assembly (5) is used for refrigerating the earmuffs (3). The headphone has a refrigeration function, can effectively solve the problem of auricle heating or sweating in the process of wearing the headset, avoids the influence on the concentration degree of a wearer, and reduces the harm to ears of a human body, so that the wearable duration of the headset is prolonged, and the headset is very humanized and personalized.

Description

technical field [0001] The invention relates to the technical field of earphones, in particular to an earphone with cooling function. Background technique [0002] Headphones are not only convenient to use, but will not affect others. Moreover, compared with in-ear earphones, wearing earphones does not need to be in the ear, so as to avoid scratching the ear canal; at the same time, the sound field is good, the comfort is high, the listening time is longer, and it has the sound quality of the sound, making the earphones more comfortable. Has a wide range of applications. [0003] However, in the process of wearing headphones for a long time, there will be friction between the pinna and the earmuffs, and at the same time, the mechanical vibration of the speaker diaphragm will generate heat, or in a relatively high temperature environment, the pinna is also prone to heat. The airtight space between the pinna and the earmuffs makes it easy to heat up or even sweat inside the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10F24F5/00F25B21/02H05K7/20
CPCH04R1/1008F24F5/0042F25B21/02H05K7/20H04R2201/10
Inventor 杨志豪杨坤杨贇
Owner 得胜电子科技(深圳)有限公司