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Sensor mounting and recycling structure and method for ESG micro-seismic monitoring system

A sensor installation hole, microseismic monitoring technology, applied in the direction of measuring devices, instruments, seismology, etc., can solve the problems that the sensor is not in close contact with the hole wall, the sensor cannot be recycled, and the monitoring effect is affected, so that it is easy to promote and use. The effect of ingenious design and simple structure

Pending Publication Date: 2019-12-03
XIAN UNIV OF SCI & TECH
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  • Application Information

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Problems solved by technology

This method is complicated to operate, and it is difficult to inject grout into the installation hole of the roof, and the sensor cannot be recycled, and the cost is high, and there is a problem that the sensor is not in close contact with the hole wall due to incomplete grouting, which affects the monitoring effect. question

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  • Sensor mounting and recycling structure and method for ESG micro-seismic monitoring system
  • Sensor mounting and recycling structure and method for ESG micro-seismic monitoring system
  • Sensor mounting and recycling structure and method for ESG micro-seismic monitoring system

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Embodiment Construction

[0046] Such as figure 1 with figure 2 The shown sensor installation and recovery structure and method for a ESG microseismic monitoring system includes an installation and fixing mechanism arranged in the sensor installation hole 15 for installing the sensor 17 and cooperating with the installation and fixing mechanism for recovering the recovery of the sensor 17. mechanism, the installation and fixing mechanism includes a sensor protection mechanism and two position adjustment mechanisms symmetrically arranged outside the sensor protection mechanism, and an outer support plate 1 is arranged outside the position adjustment mechanism;

[0047] The sensor protection mechanism includes an inner sleeve 2 for installing the sensor 17 and an outer sleeve 3 sleeved on the outside of the inner sleeve 2, and a plurality of slides are evenly arranged on the outer wall of the inner sleeve 2 along the circumferential direction. Guide prism 4, the length direction of the sliding guide pr...

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Abstract

The invention discloses a sensor mounting and recycling structure and method for an ESG micro-seismic monitoring system. The structure comprises a mounting and fixing mechanism which is arranged in asensor mounting hole and used for mounting a sensor, and a recycling mechanism which is matched with the mounting and fixing mechanism and is used for recycling the sensor. The method comprises the following steps of (1) fixing the sensor, (2) mounting an inner sleeve, (3) mounting and fixedly mounting a fixed mechanism, and (4) recycling the sensor. According to the invention, a method of using the inner sleeve and an outer sleeve together is employed, so that the sensor is mounted and fixed, the use cost of the sensor is reduced, and the sensor can be well protected. The inner sleeve is fixed in the outer sleeve through a buckle, and the sensor is recycled through the resilience of the buckle. The one-way extension of a one-way extension support column plays a role in supporting an outersupport plate, so that the sensor mounting and recycling structure can be fixed in the sensor mounting hole.

Description

technical field [0001] The invention belongs to the technical field of engineering geological microseismic monitoring, and in particular relates to a sensor installation and recovery structure and method for an ESG microseismic monitoring system. Background technique [0002] At present, microseismic monitoring technology is a relatively mature geological activity monitoring method, which is widely used in geological activity detection in mine roadways, underground chambers and large water conservancy projects. The traditional ESG Megatron sensor installation method is to use anchor rod resin to glue the top of the sensor to the sensor installation hole, and then inject grout into the hole to seal the sensor in the installation hole. This method is complicated to operate, and it is difficult to inject grout into the installation hole of the roof, and the sensor cannot be recycled, and the cost is high, and there is a problem that the sensor is not in close contact with the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01V1/28
CPCG01V1/288G01V2210/14G01V2210/16
Inventor 张超刘超靳高汉程仁辉黄晓昇薛俊华延婧孙宝强常杰曾祥真
Owner XIAN UNIV OF SCI & TECH