A kind of pressure/vibration synchronous measurement htcc composite microsensor and preparation method thereof

Abstract

The invention discloses a HTCC composite microsensor for pressure / vibration synchronous measurement and a preparation method thereof. The HTCC composite microsensor integrates pressure and vibration sensitive units, and can realize non-contact wireless synchronization of pressure / vibration dual parameters in harsh environments The test is made of 5 layers of green ceramic sheets. The surface of the first layer of green ceramic sheet and the surface of the second layer of green ceramic sheet are respectively printed with the inductance coils of two sensitive units; the surface of the third layer is printed with the capacitors corresponding to the two sensitive units. plate; the cavity structure corresponding to the sensitive unit is set on the fourth layer of green ceramic sheet; the surface of the fifth layer of green ceramic sheet is printed with two capacitor lower plates corresponding to the sensitive unit; the capacitor upper plate and the capacitor lower plate pass through the The via holes are filled with conductive platinum paste and connected to both ends of the inductance coil. The sensor of the invention can realize synchronous measurement of pressure / vibration parameters in an ultra-high temperature environment (1000°C-1500°C), has a simple preparation process and can be produced in batches.

Description

technical field [0001] The invention relates to the field of multi-parameter mechanical sensors, in particular to an HTCC composite microsensor for synchronous pressure / vibration measurement in an ultra-high temperature environment and a preparation method thereof. Background technique [0002] In some special occasions, the internal key components of some large-scale equipment (such as: aero-engines, high-speed aircraft, industrial gasifiers) are in an ultra-high temperature environment (>1000°C) for a long time during operation, and often accompanied by simultaneous pressure and vibration , if there is no real-time synchronous monitoring of the two, it may lead to abnormal operation of the equipment and potential safety hazards. Existing high-temperature pressure and vibration sensors, on the one hand, use silicon, glass, and low-melting point metals as structural materials, which cannot withstand the stress caused by elastic deformation in ultra-high temperature enviro...

AI Technical Summary

Problems solved by technology

[0002] In some special occasions, the internal key components of some large-scale equipment (such as: aero-engines, high-speed aircraft, industrial gasifiers) are in an ultra-high temperature environment (>1000°C) for a long time during operation, and often accompanied by simultaneous pressure and vibration , if there is no real-time synchronous monitoring of the two, it may lead to abnormal operation of the equipment and potential safety hazards

Existing high-temperature pressure and vibration sensors, on the one hand, use silicon, glass, and low-melting point metals as structural materials, which cannot withstand the stress caused by elastic deformation in ultra-high temperature environments and maintain structural stability; The method can cause test failure problems in ultra-high temperature environments

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