Unlock instant, AI-driven research and patent intelligence for your innovation.

Device and vacuum system for carrier alignment in a vacuum chamber and method for aligning carriers

A vacuum chamber and alignment system technology, applied in vacuum evaporation plating, transportation and packaging, semiconductor/solid-state device manufacturing, etc.

Active Publication Date: 2021-10-29
APPLIED MATERIALS INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the accurate and smooth transport of the substrate carrier carrying the substrate and / or the mask carrier carrying the mask through the vacuum system is challenging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and vacuum system for carrier alignment in a vacuum chamber and method for aligning carriers
  • Device and vacuum system for carrier alignment in a vacuum chamber and method for aligning carriers
  • Device and vacuum system for carrier alignment in a vacuum chamber and method for aligning carriers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the drawings. Within the following description of the figures, the same reference numerals refer to the same components. Generally, only differences with respect to a single implementation are described. Each example is provided by way of explanation of the disclosure, not limitation of the disclosure.

[0026] Additionally, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that this description cover such modifications and variations.

[0027] figure 1 A schematic cross-sectional view of an apparatus 100 for aligning a first carrier 10 in a vacuum chamber 101 according to embodiments described herein is shown. The term "aligned" means that the carrier is accurately positioned in a predetermined position in the vacuum ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
surface areaaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

An apparatus (100) for aligning a carrier in a vacuum chamber (101) is described. The apparatus comprises: a first carrier transport system (120) configured to transport a first carrier (10) in a first direction (X) along a first transport path; and Alignment system (130). The alignment system includes: a first support (152), the first support is used to mount the first carrier (10) to the alignment system (130); an alignment device (151), The alignment device is configured to move the first support (152) in at least one alignment direction; and a first displacement device (141) configured to cause the alignment The alignment device (151) moves together with the first support (152) in a second direction (Z) transverse to the first direction (X). Furthermore, a vacuum system and a method for aligning a carrier are described.

Description

technical field [0001] Embodiments of the present disclosure relate to an apparatus and a vacuum system for aligning a carrier in a vacuum chamber, and a method of aligning a carrier in the vacuum chamber. More specifically, a method of transporting, positioning and aligning a substrate carrier carrying a substrate in a vacuum chamber is described. Embodiments of the present disclosure specifically relate to a vacuum deposition system for depositing material on a substrate carried by a carrier, wherein the substrate is aligned relative to a mask prior to deposition. The methods and apparatus described herein can be used to fabricate organic light emitting diode (OLED) devices. Background technique [0002] Techniques for layer deposition on substrates include, for example, thermal evaporation, physical vapor deposition (PVD) and chemical vapor deposition (CVD). Coated substrates can be used in several applications and in several technical fields. For example, coated subst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68C23C14/04C23C14/56C23C16/04H01L21/677C23C16/458H01L21/687
CPCC23C14/042C23C14/564C23C14/568H01L21/67709H01L21/67712H01L21/682H01L21/6719H01L21/6773H01L21/68H01L21/6831
Inventor 马蒂亚斯·赫曼尼斯托马索·维尔切斯斯蒂芬·班格特
Owner APPLIED MATERIALS INC