Method for upgrading application chips in electronic equipment,and the electronic equipment

An electronic device and chip technology, which is applied to the upgrading method of application chips and the field of electronic devices, can solve the problems of increasing application chips and failing to upgrade electronic devices, and achieves the effect of reducing after-sales costs.

Pending Publication Date: 2019-12-13
SHENZHEN TENDZONE INTELLIGENT TECH
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the embodiments of the present invention is to provide a method for upgrading application chips in electronic equipment and electronic equipment, aiming to solve the technical problem in the prior art that the application chips in electronic equipment cannot be upgraded through the network and increase the after-sales cost of enterprises

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for upgrading application chips in electronic equipment,and the electronic equipment
  • Method for upgrading application chips in electronic equipment,and the electronic equipment
  • Method for upgrading application chips in electronic equipment,and the electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention.

[0036] An embodiment of the present invention provides an electronic device, the electronic device includes a processor, a network interface, an application chip, and a memory, and the electronic device upgrades the application chip through the network, thereby reducing the after-sales cost of the enterprise.

[0037] Such as figure 1 as shown, figure 1 It is a schematic diagram of the hardware architecture of the electronic device involved in the solution of the embodiment of the present invention.

[0038] The electronic equipment in this embodiment of the present invention may be electronic equipment such as an audio conference machine, a DVD, and a monitor.

[0039] Such as figure 1 As shown, the electronic device may include: a processor 101 , such as a central processing unit or microprocesso...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for upgrading application chips in electronic equipment. The electronic equipment comprises a processor, a memory and a plurality of application chips. The memory andthe application chips are connected with the processor. The processor is provided with a network interface. The method for upgrading the application chips in the electronic equipment comprises the following steps: the processor acquires an upgrading program through a network; and the upgrading program is written into the memory, so that the application chips read the corresponding upgrading program for upgrading. The invention further discloses the electronic equipment. According to the invention, the processor obtains the upgrading program through the network, stores the upgrading program inthe memory, and performs upgrading by reading the upgrading program in the memory when the application chips are reset, thereby achieving the beneficial effect of reducing the after-sales cost of an enterprise by upgrading the application chips in the electronic equipment through the network.

Description

technical field [0001] The invention relates to the technical field of digital circuits, in particular to an upgrading method for an application chip in an electronic device and the electronic device. Background technique [0002] With the development of technology, the replacement cycle of electronic equipment such as audio conferencing machines, DVDs and monitors is getting shorter and shorter. Once these devices are sold, they are scattered all over the country. Since the main processor in the electronic device cannot directly transmit the upgrade program to the application chip, the electronic device cannot be directly upgraded through the network. The application chips in these electronic devices are often connected to an external memory through a USB port, or connected to a computer through a serial port for offline upgrade. This offline upgrade method will increase the after-sales cost of the enterprise. [0003] The above content is only used to assist in understand...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F8/65
CPCG06F8/65
Inventor 曹高翔季海交谌名林黄维谭宜平
Owner SHENZHEN TENDZONE INTELLIGENT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap