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Chip packaging equipment

A chip packaging and equipment technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of low packaging efficiency and high cost, and achieve the effect of improving efficiency and reducing costs

Pending Publication Date: 2019-12-24
SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, multiple devices are required to cooperate to complete chips of different sizes and types, the cost is high, and the packaging efficiency is low

Method used

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  • Chip packaging equipment

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] Such as figure 1 As shown, an embodiment of the present invention provides a chip packaging device, which includes: a chip loading platform 1 , a calibration mechanism 2 , a feeding cantilever 3 and a chip feeding mechanism 4 .

[0018] The sheet feeding mechanism 4 is used to provide chips of different sizes and types, and specifically includes: several magazines 41 of different sizes, and each magazine 41 is located at a feeding position. Wherein, an...

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Abstract

The invention provides chip packaging equipment. The chip packaging equipment comprises a chip mounting table, a conveying arm, a calibration mechanism, a feeding cantilever and a chip supply mechanism, wherein the chip supply mechanism comprises a plurality of material boxes with different sizes, and each material box is positioned at the corresponding feeding position; the feeding cantilever ispositioned between the chip supply mechanism and the calibration mechanism, and comprises a rotary arm shaft, a plurality of cantilevers driven by the rotary arm shaft to pivot, and a cam driving therotary arm shaft to move up and down; the plurality of cantilevers are distributed around the rotary arm shaft and a suction nozzle is arranged on any cantilever; the calibration mechanism comprises acalibration table, an industrial camera and a conveying arm, the industrial camera and the conveying arm are arranged above the calibration table, and the calibration table performs rotary calibration by taking the axis of the calibration table as a rotating shaft; the conveying arm performs reciprocating motion in the vertical direction; and the chip mounting table is located on the downstream side of the calibration mechanism. By the adoption of the material boxes of different sizes and the feeding cantilever, feeding of chips of different sizes and types is facilitated, and packaging of the chips of different sizes and types can be achieved through one piece of equipment.

Description

technical field [0001] The invention relates to a chip packaging device, in particular to a device capable of adapting to chip packaging of various sizes. Background technique [0002] Chips are cut from large-size wafers and come in a variety of sizes. During the application process, the cut chips need to be packaged. In the current packaging equipment, it is usually only for chips of a single specification and size. For chips of different sizes and types, it is usually necessary to package the chips on the base of the carrier board through different equipment. In this way, multiple devices are required to cooperate to complete chips of different sizes and types, the cost is high, and the packaging efficiency is low. Therefore, it is necessary to propose a further solution for how to improve the packaging efficiency of chips of different sizes. Contents of the invention [0003] The present invention aims to provide a chip packaging device to overcome the deficiencies ...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/677H01L21/683
CPCH01L21/561H01L21/677H01L21/683
Inventor 不公告发明人
Owner SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD