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Circuit board hole plugging method and circuit board

A circuit board, plug hole technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of air bubbles, voids, depressions, etc., to reduce the time and avoid the effect of air bubbles

Active Publication Date: 2019-12-27
深圳市华升鑫电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, plugging the isolation holes of PCB boards in the industry mainly uses ordinary screen printing machines to print resin ink plugging holes. This plugging method needs to make screen plates and backing plates for plugging holes. Bubbles, voids, depressions and other quality problems will occur during the process, and blind holes cannot be plugged

Method used

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  • Circuit board hole plugging method and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] S10 plating a metal layer, plating a copper metal layer with a thickness of 15um on the inner wall of the through hole on the circuit board through an electroplating process. S20 film sticking, sticking a protective film on the circuit board that needs plug holes to get the first circuit board. S30 opening a window, and performing film removal treatment on the through holes on the first circuit board to obtain a second circuit board. S40 Vacuum treatment, performing vacuum treatment on the second circuit board, so that the protective film in the area outside the through hole is closely adhered to obtain a third circuit board. S50 plugging the holes, vibrating and printing the resin ink on the third circuit board, so that the through holes are filled with the resin ink to obtain a fourth circuit board. and S60 curing treatment, performing curing treatment on the resin ink in the through hole of the fourth circuit board. In the first baking process, the fourth circuit b...

Embodiment 2

[0030] S10 plating a metal layer, plating a copper metal layer with a thickness of 25um on the inner wall of the through hole on the circuit board through an electroplating process. S20 film sticking, sticking a protective film on the circuit board that needs plug holes to get the first circuit board. S30 opening a window, and performing film removal treatment on the through holes on the first circuit board to obtain a second circuit board. S40 Vacuum treatment, performing vacuum treatment on the second circuit board, so that the protective film in the area outside the through hole is closely adhered to obtain a third circuit board. S50 plugging the holes, vibrating and printing the resin ink on the third circuit board, so that the through holes are filled with the resin ink to obtain a fourth circuit board. and S60 curing treatment, performing curing treatment on the resin ink in the through hole of the fourth circuit board. In the first baking process, the fourth circuit b...

Embodiment 3

[0032]S10 plating a metal layer, plating a copper metal layer with a thickness of 45um on the inner wall of the through hole on the circuit board through an electroplating process. S20 film sticking, sticking a protective film on the circuit board that needs plug holes to get the first circuit board. S30 opening a window, and performing film removal treatment on the through holes on the first circuit board to obtain a second circuit board. S40 Vacuum treatment, performing vacuum treatment on the second circuit board, so that the protective film in the area outside the through hole is closely adhered to obtain a third circuit board. S50 plugging the holes, vibrating and printing the resin ink on the third circuit board, so that the through holes are filled with the resin ink to obtain a fourth circuit board. and S60 curing treatment, performing curing treatment on the resin ink in the through hole of the fourth circuit board. In the first baking process, the fourth circuit bo...

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PUM

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Abstract

The invention provides a circuit board hole plugging method and a circuit board. The method comprises the following steps of: film pasting: a protection film is pasted on a circuit board needing holeplugging, so that a first circuit board is obtained; windowing: film removing processing is carried out on through holes in the first circuit board, so that a second circuit board is obtained; vacuumtreatment: vacuumizing treatment is performed on the second circuit board, so that the protection film in regions outside the through holes is tightly attached to the second circuit board, so that a third circuit board is obtained; hole plugging: the third circuit board is subjected to resin ink vibration and printing, so that the through holes can be filled with resin ink, and a fourth circuit board is obtained; and curing treatment: curing treatment is performed on the resin ink in the through holes of the fourth circuit board. A vibration printing mode is adopted for hole plugging, and therefore, time for forming resin plug holes in the circuit board is effectively shortened, and quality problems such as bubbles, cavities and recesses generated in a hole plugging process are avoided.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for plugging holes in a circuit board and the circuit board. Background technique [0002] As printed circuit boards tend to be more dense and multi-functional, the reliability requirements for circuit boards are also increasing. In order to meet the needs of producing different electronic products, the PCB boards designed and manufactured have been developed from single-layer boards to double-layer boards or multi-layer boards. Generally, when manufacturing double-layer or multi-layer PCB boards, there is a requirement to isolate the metal base layer for circuit connection. For this reason, it is necessary to set relative isolation holes on the metal base layer to plug holes, so that the circuits on each layer of circuit boards are connected to the isolated metal base layer to form a relative on-off circuit. [0003] At present, plugging the isolation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40H05K3/42
CPCH05K3/0094H05K3/40H05K3/429
Inventor 吴艳杰刘兆毛建国
Owner 深圳市华升鑫电路有限公司