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Package, light-emitting device, and method of manufacturing package

A lead, molding technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as low degrees of freedom

Pending Publication Date: 2019-12-31
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the degree of freedom of design is low because the shape and size of the package are limited.

Method used

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  • Package, light-emitting device, and method of manufacturing package
  • Package, light-emitting device, and method of manufacturing package
  • Package, light-emitting device, and method of manufacturing package

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 》

[0050] Figure 1A It is a perspective view schematically showing the configuration of the package and the light emitting device according to the first embodiment. Figure 1B It is a plan view schematically showing the structure of the package and the light emitting device according to the first embodiment. Figure 2A yes Figure 1B Sectional view of line IIA-IIA. Figure 2B yes Figure 1B Sectional view of line IIB-IIB. Figure 3A It is a plan view schematically showing the structure of the first lead according to the first embodiment. Figure 3B It is a plan view schematically showing the structure of the second lead according to the first embodiment. Figure 4A It is a perspective view schematically showing the structure of the first lead according to the first embodiment provided with the first molded body. Figure 4B It is a perspective view schematically showing the structure of the second lead according to the first embodiment provided with the second molded body. ...

no. 2 approach 》

[0137] Figure 7A is a cross-sectional view schematically showing the structure of the package and the light emitting device according to the second embodiment, corresponding to Figure 1B Sectional view of line IIA-IIA. Figure 7B is a cross-sectional view schematically showing the structure of the package and the light emitting device according to the second embodiment, corresponding to Figure 1B Sectional view of line IIB-IIB.

[0138] [Package and light emitting device]

[0139] Package 1A has first lead 10 , second lead 20 , and molded body 6 .

[0140] Light emitting device 100A has package 1A, light emitting element 2 , underfill 3 , frame body 4 , and covering member 5 .

[0141] In the package 1A of the light emitting device 100A according to the second embodiment, the molded body 6 of the first lead 10 and the molded body 6 of the second lead 20 are integrated to form one molded body 6 . Furthermore, the molded body 6 holds the first lead 10 and the second lead...

other Embodiment approach

[0157] Figure 9A is a cross-sectional view schematically showing the structure of a light emitting device according to another embodiment, corresponding to Figure 1B Sectional view of line IIA-IIA. Figure 9B is a cross-sectional view schematically showing the structure of a light emitting device according to another embodiment, corresponding to Figure 1B Sectional view of line IIB-IIB. Figure 10 It is a plan view schematically showing the structure of a light emitting device according to another embodiment. Figure 11A It is a top view schematically showing the structure of the second lead according to another embodiment. Figure 11B It is a plan view schematically showing the structure of a light emitting device according to another embodiment. Figure 12A It is a cross-sectional view showing a step of forming a sheet member in a method of manufacturing a light emitting device according to another embodiment. Figure 12B It is a cross-sectional view showing a step o...

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PUM

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Abstract

The present invention provides a package having a high degree of freedom of design, a light-emitting device, and methods for manufacturing the package and the light-emitting device. The package (1) has a first lead (10) having a first portion; a first molded body (61) that holds the first lead (10); a second lead wire (20) bonded to the first lead wire (10) so as to face the first lead wire (10) and having a second portion overlapping the first portion of the first lead wire (10) in plan view; and a second molded body (62) which holds the second lead (20), wherein a first portion of the firstlead (10) and a second portion of the second lead (20) are electrode terminals, the first lead (10) and the second lead (20) being directly bonded at portions of the first portion and the second portion that are exposed from the first molded body (61) and the second molded body (62).

Description

technical field [0001] The present disclosure relates to packages, light emitting devices and methods of their manufacture. Background technique [0002] Various packages are disclosed regarding packages used in light-emitting devices. For example, Patent Document 1 discloses a package in which a first lead frame and a second lead frame having different shape patterns are laminated. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2013-101996 [0004] In the above patent document, in order to fill the bonding member for bonding the first lead frame and the second lead frame, it is necessary to provide a groove portion and an opening portion of a predetermined size at a predetermined position of the lead frame. Therefore, there is a problem that the degree of freedom in design is low because the shape, size, etc. of the package are restricted. In addition, in recent years, packages with a high degree of freedom in design are desired. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/54H01L33/64
CPCH01L33/62H01L33/54H01L33/647H01L2933/005H01L2933/0066H01L33/644H01L33/507H01L33/641H01L33/60
Inventor 盐田勇树
Owner NICHIA CORP