Lip seal with improved byproduct deposition problem and semiconductor processing device containing same
A technology for engineering devices and by-products, applied in the field of semiconductor engineering devices, can solve problems such as increased leakage, decreased substrate engineering uniformity, incomplete contact, etc., to prevent uniformity decrease, prevent incomplete contact, and reduce heat transfer gas leaked effect
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[0048] The lip seal which improves the problem of by-product vapor deposition and the semiconductor engineering device including the lip seal of the present invention will be described in detail below with reference to the accompanying drawings.
[0049] By-products generated during the semiconductor process of the substrate S are vapor-deposited on the lip seal 100 .
[0050] Due to this by-product evaporated on the lip seal 100, there is a problem of incomplete contact when the substrate S is in contact with the lip seal 100.
[0051] Furthermore, the leakage amount of the heat transfer gas to the portion where the substrate S and the lip seal 100 do not completely contact increases.
[0052] This increase in the leakage of heat transfer gas will cause a temperature difference between the portion of the substrate S where the leakage of heat transfer gas has increased and the portion where the leakage of heat transfer gas has not increased, and this temperature difference wil...
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