Method and device for removing diaphragm on surface of plate
A diaphragm and plate technology, which is applied in the field of removing the diaphragm on the surface of the plate, can solve the problems of scattered plates, affecting the positioning operation of the plate, etc.
Inactive Publication Date: 2020-01-17
SHENNAN CIRCUITS
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Problems solved by technology
The processing process of the board usually includes the operation of removing the film of the board and the operation of positioning and positioning the board. The operation of removing the film of the board is to use a suction cup to remove the diaphragm on the surface of the board. When the membrane is in operation, the suction cup absorbs the diaphragm and shakes the diaphragm to break the vacuum between the two, but the shaking of the diaphragm will lift the plate, and then the plate will break away from the diaphragm and fall freely under its own gravity, which often leads to scattered plates , thus affecting the subsequent positioning operation of the plate
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0028] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
[0029] In addition, in t...
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Abstract
The invention discloses a method and a device for removing a diaphragm on the surface of a plate. The method for removing the diaphragm on the surface of the plate comprises the following steps of: forming a blowing hole on the surface of the diaphragm; and blowing air into the blowing hole to break vacuum between the plate and the diaphragm, and sucking the diaphragm to separate from the plate. By the technical scheme, the vacuum between the plate and the diaphragm can be effectively broken, so that the phenomenon that the subsequent positioning operation is influenced due to the scattering of the plate is effectively avoided.
Description
technical field [0001] The invention relates to the technical field of plate film removal, in particular to a method and device for removing a film on the surface of a plate. Background technique [0002] In the related art, the surface of the panel is usually covered with a layer of air-tight membrane to protect the panel during transportation or storage. The processing process of the board usually includes the operation of removing the film of the board and the operation of positioning and positioning the board. The operation of removing the film of the board is to use a suction cup to remove the diaphragm on the surface of the board. When the membrane is in operation, the suction cup absorbs the diaphragm and shakes the diaphragm to break the vacuum between the two, but the shaking of the diaphragm will lift the plate, and then the plate will break away from the diaphragm and fall freely under its own gravity, which often leads to scattered plates , thus affecting the su...
Claims
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IPC IPC(8): B65B69/00B32B38/10
CPCB65B69/00B32B38/10
Inventor 王永来彭梁
Owner SHENNAN CIRCUITS