Dust-free cutting machine device and circuit board dust-free cutting method
A technology for circuit boards and cutting machines, which is used in printed circuits, printed circuit manufacturing, electrical components, etc., and can solve problems such as incomplete dust removal.
Active Publication Date: 2021-04-09
NEW FOUNDER HLDG DEV LLC +1
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Problems solved by technology
[0005] The invention provides a dust-free cutting machine device and a circuit board dust-free cutting method, which are used to solve the technical problem of incomplete dust removal caused by air pressure blowing dust to remove dust on PP in the prior art
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[0041] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. All other embodiments obtained based on the embodiments of the present invention belong to the protection scope of the present invention.
[0042] For convenience of description, the sizes of different layers and regions are enlarged or reduced, so the sizes and ratios shown in the drawings do not necessarily represent actual sizes, nor do they reflect the proportional relationship of sizes.
[0043] With the rapid development of electronic information technology, the printed circuit board (Printed Circuit Board, referred to as PCB) is developing towa...
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The invention provides a dust-free cutting machine device and a circuit board dust-free cutting method, the device includes a cutting part, a dust suction part and a negative pressure dust suction pipe; Cutting needs to cut the circuit board to be cut; the dust suction part is arranged in front of the cutting part along the traveling direction of the circuit board to be cut, and is used for cutting the circuit board to be cut The generated PP dust is absorbed; the negative pressure dust suction pipe is connected with the dust suction component to provide the suction component with an adsorption pressure to absorb the PP dust. By setting the dust suction part in front of the cutting device along the traveling direction of the circuit board to be cut, the suction pressure is generated through the negative pressure dust suction pipe so that the PP dust generated during the cutting process of the circuit board to be cut can be collected by the dust suction part connected with it. Absorption, so that the PP dust generated during the cutting process of the circuit board can be completely removed, and the health of the operator can be guaranteed while improving the product quality.
Description
technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a dust-free cutting machine device and a circuit board dust-free cutting method. Background technique [0002] With the rapid development of electronic information technology, the printed circuit board (Printed Circuit Board, referred to as PCB) is developing towards high density and high integration. , The advantage of higher interconnection density, therefore, the application of multi-layer PCB will become more and more extensive. At present, multilayer PCB boards are usually made by the layer-building method. The multilayer printed circuit boards made by this method usually include one or more adjacent inner core boards in the center, and two adjacent inner core boards The boards are glued together through an insulating dielectric layer (PP also known as: resin connection sheet) to form a multilayer circuit board substrate; the upper and lower sides of the m...
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IPC IPC(8): H05K3/00
CPCH05K3/0052H05K3/0055
Inventor 曹磊磊黄云钟王成立涂逊唐耀郭艳君
Owner NEW FOUNDER HLDG DEV LLC