Wafer dotting device

Abstract

The invention discloses a wafer dotting device. The wafer dotting device structurally comprises a machine body, a reaction box body, a conveying roller, a power shaft and bottom feet, wherein the reaction box body is arranged at the top of the machine body. The wafer dotting device has the beneficial effects that the reaction box body is arranged on the structure to solve the problem, an electricfield device in the reaction box body is used for changing the physical property of electrons, and the synchronization of rapid change of molecules and the frequency of particles is realized; meanwhile, the unique hollow triangular cone structure of a particle baffle is used for avoiding the secondary sputtering effect on a wafer caused by the fact that the particles fall again after colliding with the particle baffle after bouncing; and a particle absorber is arranged to accelerate the absorption of the rebounded particles, so that the secondary adverse reaction influence of the particles onthe wafer is reduced to the maximum extent.

Description

technical field [0001] The invention relates to the field of wafer production, in particular to a wafer marking device. Background technique [0002] Wafer is a chip carrier with high value, and its processing technology is quite complicated. Generally, the wafer is properly cleaned first, then oxidized and chemical vapor deposited on its surface, and then coated, exposed, developed, etched, and ionized. Repeated steps such as implantation and metal sputtering, finally complete the processing and manufacturing of bundle layer circuits and components on the wafer. Sputtering is also called dotting. It uses high-speed particles to hit the solid surface to knock out the atoms on the solid surface. This phenomenon In this process, because the oscillation frequency of the electric field changes too fast, it is easy for the positive ions to fail to keep up with the change, so that the solid surface exhibits a cathode effect, resulting in dot failure. At the same time, the particle...

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Problems solved by technology

[0002] Wafer is a chip carrier with high value, and its processing technology is quite complicated. Generally, the wafer is properly cleaned first, then oxidized and chemical vapor deposited on its surface, and then coated, exposed, developed, etched, and ionized. Repeated steps such as implantation and metal sputtering, finally complete the processing and manufacturing of bundle layer circuits and components on the wafer. Sputtering is also called dotting. It uses high-speed particles to hit the solid surface to knock out the atoms on the solid surface. This phenomenon In this process, because the oscillation frequency of the electric field changes too fast, it is easy for the positive ions to fail to keep up with the change, so that the solid surface exhibits a cathode effect, resulting in dot failure. At the same time, the particles will fall to the circle again during the impact process. Crystal formation and secondary sputtering affect the final product effect. Based on the above premise, this case developed a wafer dotting equipment to solve this problem.

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