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A cooling device for a server

A technology of a cooling device and a server, applied in the computer field, can solve the problems of poor heat dissipation effect at the bottom of the server, poor heat dissipation effect of the server, and a large amount of calculation.

Active Publication Date: 2021-07-06
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to process data quickly, cloud computing has huge servers to store data and provide fast computing hardware and software support. In the past, cloud computing servers were placed directly in a dust-free underground space. Fast, the speed of heat dissipation is slow only through spontaneous heat and cold exchange with the indoor air, the server may be damaged due to high temperature, and the server is placed directly on the ground, which will result in poor heat dissipation at the bottom of the server
[0003] For the problem of poor heat dissipation at the bottom of the server in the prior art, there is currently no effective solution

Method used

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  • A cooling device for a server

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0025] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.

[0026] Based on the above purpose, an embodiment of the present invention proposes an embodiment of a server cooling device capable of improving the heat dissipation effect at the bottom of the server. figure 1 What is shown is a schematic structura...

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Abstract

The invention discloses a heat dissipation device for a server, which comprises using a suspended server platform to prop up the server, a plurality of heat dissipation holes are evenly arranged on the server platform, and a driving end of a hydraulic cylinder is connected to a horizontal plate provided with a plurality of protrusions through a telescopic rod. A plurality of cooling holes and a plurality of protrusions cooperate with each other to block or release the plurality of cooling holes under the action of a hydraulic cylinder, while using a plurality of ventilation holes and a built-in fan on the vertical support plate for ventilation. The invention can improve the heat dissipation effect at the bottom of the server and maintain the normal operation of the server.

Description

technical field [0001] The present invention relates to the field of computers, and more specifically, to a cooling device for a server. Background technique [0002] In order to process data quickly, cloud computing has huge servers to store data and provide fast computing hardware and software support. In the past, cloud computing servers were placed directly in a dust-free underground space. Fast, the speed of heat dissipation is slow only through spontaneous heat and cold exchange with the indoor air, the server may be damaged due to high temperature, and the server is placed directly on the ground, which will result in poor heat dissipation at the bottom of the server. [0003] There is currently no effective solution to the problem of poor heat dissipation at the bottom of the server in the prior art. Contents of the invention [0004] In view of this, the purpose of the embodiments of the present invention is to provide a heat dissipation device for a server, which...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20
Inventor 牟兴国任启立
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD