A hollow microstructure of LED and its manufacturing method
A manufacturing method and microstructure technology, applied in the field of optics and lasers, can solve the problems of difficult continuous improvement and industrial quantification, low cost competitiveness, complex manufacturing process, etc., to improve external quantum efficiency, fine microstructure, application Wide range of effects
Active Publication Date: 2021-08-17
CENT SOUTH UNIV
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Problems solved by technology
Generally, surface roughening can only slightly improve the light extraction efficiency of LEDs, and it is difficult to continuously improve and industrialize it; patterned substrate technology can effectively expand the light output area to improve the external quantum efficiency, but its realization process requires complex multi-step semiconductor manufacturing process, and requires expensive precision photolithography mask; flip-chip technology effectively avoids the influence of luminous efficiency due to the occupation of the light-emitting area by the electrode in the front-mounted chip, so that the light excited by the light-emitting layer is directly emitted from the other side of the electrode, but the inverted Chip-mounting technology has subverted the traditional LED process. From the chip to the packaging process, the equipment requirements are higher. In the application of small and medium-power LEDs, the cost competitiveness is not very strong; the surface microstructure technology continues to improve with the continuous improvement of the surface structure manufacturing process level. To improve, researchers began to explore the process of processing micro-nano structure arrays on the surface of LEDs, using the waveguide characteristics of the arrays to improve the external quantum efficiency of LEDs. At the same time, this method can avoid damage to LED chips because it is mainly realized by external manufacturing processes. , and does not need to change the original manufacturing process of the LED, it has received more and more attention, but the surface microstructure technology will inhibit the light emission within the total reflection light cone
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[0034] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0035] The invention discloses a method for manufacturing a hollow microstructure of an LED, comprising the following steps:
[0036] S1. Place and fix an LED 13 to be processed on the three-dimensional platform 14, select a suitable optical element, build an optical path system, and align the objective lens with the LED 13 to be processed;
[0037] S2. Adjust the observation optical path, and combine the movement of the three-dimensional platform 14 to position the femtosecond laser focus point to the target position on the surface or inside of the LED 13 to be processed;
[0038] S3. Control the movement of the three-dimensional platform 14 and the on-off cooperation of...
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Abstract
The invention relates to the field of optics and laser technology. The invention discloses a hollow microstructure of an LED, which includes a hollow area and a microstructure area on the LED. Hollow area, the hollow area is located above the LED light source, overlapping with the cross-section of the total reflection light cone at the height of the microstructure array; also discloses a method for manufacturing the hollow microstructure of the LED and the manufacturing method adopted The light path system, this structure can effectively improve the light intensity and light efficiency of the LED.
Description
technical field [0001] The invention relates to the field of optics and laser technology, in particular to LED microstructure technology and a manufacturing method thereof. Background technique [0002] Semiconductor light-emitting diode (LED) is a new type of green light source. With its unique advantages, it will lead the future development trend in the lighting field and will become the "fourth generation light source" after incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps. . At the same time, LED has the advantages of small size, light weight, good directionality, long life, energy saving, environmental protection, etc., and is widely used in many aspects of our daily life. However, considering the high initial manufacturing cost of high-performance LEDs, it is necessary to realize them in the lighting field To fully replace the existing traditional lighting sources needs to further improve the luminous efficiency of LEDs. Improving the lum...
Claims
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IPC IPC(8): B23K26/046B23K26/352H01L33/20
CPCB23K26/046B23K26/352H01L33/20
Inventor张帆赵于前段吉安
OwnerCENT SOUTH UNIV