Display device and manufacturing method thereof

Abstract

The invention discloses a display device, which comprises a display panel, a display circuit board, a touch circuit board, a support layer, a first heat dissipation layer and a second heat dissipationlayer. A first end of the display circuit board is electrically connected to the display panel. A first end of the touch circuit board is electrically connected to the display panel. The support layer is disposed on the surface of the display panel. The first heat dissipation layer and the second heat dissipation layer are respectively arranged on both sides of the support layer. A second end ofthe display circuit board and a second end of the touch circuit board are respectively arranged on the first heat dissipation layer and the second heat dissipation layer. A connecting piece is also arranged between the first heat dissipation layer and the second heat dissipation layer. According to the invention, since the connecting piece is arranged between the first heat dissipation layer and the second heat dissipation lay, it is further ensured that electrical connection between the display circuit board and the touch circuit board is realized, so that the grounding potential between thedisplay circuit board and the touch circuit board is the same, the situation that the display panel is injured during electrostatic testing is avoided, and the safety is improved.

Description

Technical field [0001] The present invention relates to the field of display technology. More specifically, it relates to a display device and a manufacturing method Background technique [0002] The market share of AMOLED display devices is getting higher and higher. At present, in order to achieve a higher screen-to-body ratio, various brands have introduced bangs, water drops, and in-screen perforated display designs; however, with the popularization of 5G technology in the future, the existing size It may not meet the needs of consumers, so large-screen display may become a direction of future development. Considering the portability of mobile communication devices and the excellent performance of AMOLED with flexibility and bending, the future foldable screen is bound to be more widely used. Pay attention. [0003] figure 1 It shows a schematic diagram of the layer structure of an AMOLED display device in the prior art. In order to achieve foldability, the heat dissipation l...

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Problems solved by technology

[0002] The market share of AMOLED display devices is getting higher and higher. At present, in order to achieve a higher screen ratio, various brands have introduced notch, water drop, and in-screen perforated display designs; however, with the popularization of 5G technology in the future, the existing size It may not meet the needs of consumers, so large-screen display may become a direction of future development. Considering the portability of mobile communication devices and the excellent performance of AMOLED's flexibility and bendability, foldable screens are bound to receive wider attention in the future. Pay attention to

[0003] figure 1 A schematic diagram of the layer structure of an AMOLED display device in the prior art is shown. In order to realize foldability, the heat dissipation layer of the AMOLED display device is generally divided into two independent layers ( figure 1 The first heat dissipation layer 500 and the second heat dissipation layer 600), the display circuit board 200 and the touch circuit board 300 are respectively attached to the two heat dissipation layers, which may cause the grounding of the display circuit board and the touch circuit board The potential is uneven, which will damage the display panel during the electrostatic test 100

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