Wafer cleaning liquid recovery equipment

A technology for recycling equipment and cleaning fluids, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as manual determination, incomplete sorting and recycling, and trouble.

Inactive Publication Date: 2020-03-27
王挺
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

By using the wafer cleaning liquid recovery device described in the present invention, various wafer cleaning liquids can be effectively collected and discharged separately, reducing the possibility of chemical reactions between various cleaning liquids and reducing the need for discharge pipes. The damage caused effectively improves the service life and safety of the discharge pipe, but the invention still causes water leakage during sorting and recycling, the sorting and recycling are not complete, and the type of cleaning fluid needs to be determined manually, which is troublesome

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer cleaning liquid recovery equipment
  • Wafer cleaning liquid recovery equipment
  • Wafer cleaning liquid recovery equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-6 , the present invention provides a technical solution for wafer cleaning liquid recovery equipment: its structure includes a mobile recovery device 1, a shutter 2, a deflector 3, a turntable 4, a rotating shaft 5, a motor 6, and a pushing device 7. The bottom of the turntable 4 It is connected with the rotating shaft 5, the bottom of the rotating shaft 5 is connected with the motor 6 arranged in the deflector 3, the left side of the defl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses wafer cleaning fluid recovery equipment. The wafer cleaning fluid recovery equipment structurally comprises a movable recovery device, a shielding device, a fluid director, a turntable, a rotating shaft, a motor and a pushing device, wherein the bottom of the turntable is connected with the rotating shaft; the bottom of the rotating shaft is connected with the motor arranged in the fluid director; the shielding device is arranged on the left side of the fluid director; the movable recovery device is mounted below the fluid director; a movable recovery tank is movably connected with the pushing device; the fluid director comprises side plates, an inclined plate, a coaming and a bottom plate; the bottom of the coaming is connected with the bottom plate; two ends of the coaming are respectively connected with the side plates; the inclined plate is connected with the bottom plate and the coaming; and the movable recovery device includes a sliding rail, a recycling groove, an output pipe, a partition plate and a support plate. The wafer cleaning fluid recovery equipment has the beneficial effects that through the design, cleaning liquid can directly flow into thecorresponding recovery tank, and the phenomenon of splashing or water leakage cannot occur, and the type of the cleaning liquid can be judged through the PH value, and the position of the recovery tank is automatically adjusted, and the wafer cleaning fluid recovery equipment is more intelligent.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a wafer cleaning liquid recycling device. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and becomes an integrated circuit with specific electrical functions. circuit products. [0003] The existing patent No. 201711167935.9 wafer cleaning liquid recovery device includes a recovery unit, a lifting unit and a discharge unit, and the recovery unit includes a plurality of annular recovery tanks arranged continuously in the vertical direction; The unit is used to control the recovery unit to move in the vertical direction, so that the plurality of recovery tanks on the recovery unit are used to recover different wafer cleaning liquids respectively; the discharge unit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/6704
Inventor 王挺
Owner 王挺
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products