89results about How to "There will be no water leakage" patented technology

The invention discloses wafer cleaning fluid recovery equipment. The wafer cleaning fluid recovery equipment structurally comprises a movable recovery device, a shielding device, a fluid director, a turntable, a rotating shaft, a motor and a pushing device, wherein the bottom of the turntable is connected with the rotating shaft; the bottom of the rotating shaft is connected with the motor arranged in the fluid director; the shielding device is arranged on the left side of the fluid director; the movable recovery device is mounted below the fluid director; a movable recovery tank is movably connected with the pushing device; the fluid director comprises side plates, an inclined plate, a coaming and a bottom plate; the bottom of the coaming is connected with the bottom plate; two ends of the coaming are respectively connected with the side plates; the inclined plate is connected with the bottom plate and the coaming; and the movable recovery device includes a sliding rail, a recycling groove, an output pipe, a partition plate and a support plate. The wafer cleaning fluid recovery equipment has the beneficial effects that through the design, cleaning liquid can directly flow into thecorresponding recovery tank, and the phenomenon of splashing or water leakage cannot occur, and the type of the cleaning liquid can be judged through the PH value, and the position of the recovery tank is automatically adjusted, and the wafer cleaning fluid recovery equipment is more intelligent.