Electrostatic chuck function hole anti-blocking device

Abstract

The invention relates to an anti-blocking device for a function hole of an electrostatic chuck, which relates to a device used for an integrated process of an electrostatic chuck. The purpose is to provide an anti-blocking device for the functional holes of the electrostatic chuck that can effectively prevent each functional hole of the electrostatic chuck from being blocked during the process of pressurizing the adhesive. The electrostatic chuck functional hole anti-blocking device of the present invention is used to prevent the adhesive layer of the electrostatic chuck from blocking the functional hole on the electrostatic chuck when pressurized. The anti-blocking device is detachably connected to the functional hole. The anti-blocking device includes the first An anti-blocking part and a second anti-blocking part used in conjunction with the first anti-blocking part, the shape of the first anti-blocking part matches the shape of the functional hole, and the outer diameter of the first anti-blocking part is not smaller than the diameter of the functional hole And the first anti-blocking part can extend into the functional hole to realize the sealing of the functional hole, the first anti-blocking part is provided with an accommodating cavity, and the shape of the second anti-blocking part matches the shape of the accommodating cavity. The second anti-blocking member can be inserted into the accommodating cavity so that the first anti-blocking member can smoothly extend into the functional hole.

Description

technical field [0001] The invention relates to the field of design and manufacture of semiconductor equipment, in particular to a device for an electrostatic chuck integration process. Background technique [0002] As a precision device for carrying and fixing wafers, electrostatic chucks are often used in process chambers of semiconductor equipment. In addition to maintaining a stable adsorption force, they also need to provide accurate wafer temperatures. [0003] The bonding process is usually used as an integration method in the electrostatic chuck manufacturing process. The bonding process is a method of connecting at least two parts together through an adhesive. Compared with welding, brazing and screwing, it has many advantages, such as firm bonded joints, good fatigue resistance, uniform load distribution, and It satisfies the connection of different materials very well. The bonding process is widely used in the processing and manufacturing process of semiconducto...

AI Technical Summary

Problems solved by technology

In order to ensure the reliability of the bonding, it is necessary to pressurize during the bonding and patching operation, so that a small amount of adhesive that is unavoidable will enter into each hole on the bonding surface, especially small non-straight holes (such as air holes) ), blocked by the adhesive, it is difficult to clean up, which in turn affects the functions of air holes, electrode holes, Pin holes, etc.

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