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Integrated circuit repairing method and device, storage medium and electronic equipment

A technology for integrated circuits and electronic equipment, which is applied in the computer field and can solve the problems of waste of repairing circuits, low prediction accuracy of packaging and test data, and low repair accuracy.

Active Publication Date: 2020-04-10
CHANGXIN MEMORY TECH INC
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AI Technical Summary

Problems solved by technology

[0006] The purpose of the present disclosure is to provide a method and device for repairing an integrated circuit, a storage medium, and an electronic device, thereby at least to a certain extent overcoming the low prediction accuracy of packaging test data, low repair accuracy, waste of repair circuits, and inability to shorten Issues with Time to Repair and Reduced Repair Costs

Method used

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  • Integrated circuit repairing method and device, storage medium and electronic equipment
  • Integrated circuit repairing method and device, storage medium and electronic equipment
  • Integrated circuit repairing method and device, storage medium and electronic equipment

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Embodiment Construction

[0047] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus their repeated descriptions will be omitted.

[0048] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or mo...

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Abstract

The invention relates to the technical field of computers, in particular to an integrated circuit repairing method and a device, a storage medium and electronic equipment. The method comprises the steps of obtaining chip test data of a to-be-repaired integrated circuit; predicting packaging test data of the to-be-repaired integrated circuit according to the chip test data in combination with a prediction model constructed by a deep learning network; and repairing the integrated circuit to be repaired according to the chip test data and the package test data. According to the method and the device, the influence of human factors is avoided, the prediction accuracy of the packaging test data is greatly improved, the phenomenon of circuit repair waste is further avoided, and in addition, theprediction accuracy of the packaging test data is greatly improved, so that the repair time can be well shortened, and the repair cost is reduced.

Description

technical field [0001] The present disclosure relates to the field of computer technology, and in particular to an integrated circuit repair method and device, a storage medium, and electronic equipment. Background technique [0002] In order to improve the production yield, when there is error data in the chip test data of the integrated circuit, the error position corresponding to the error data in the integrated circuit can be repaired through the repair circuit preset in the integrated circuit. When there is erroneous data in the packaging test data, the erroneous position corresponding to the erroneous data in the integrated circuit can be repaired by the remaining repairing circuit in the circuit. [0003] Since there is only a difference between the cutting and packaging process from the chip test of the integrated circuit to the packaging test of the integrated circuit, the packaging test of the integrated circuit can be performed according to the error data in the c...

Claims

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Application Information

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IPC IPC(8): G06F30/3308G06F30/367G06F30/398
Inventor 林家圣
Owner CHANGXIN MEMORY TECH INC
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