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Surface modification device

A surface modification and gas replacement technology, which is applied to electrical components, plasma, chemical/physical/physicochemical processes, etc., can solve the problems of high cost, high price, and poor production efficiency, so as to reduce production costs and facilitate The effect of forming and improving dimensional accuracy

Active Publication Date: 2020-04-10
KASUGA DENKI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, generally speaking, the replacement gas used for surface modification is expensive, so it is costly and the production efficiency will be deteriorated

Method used

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Experimental program
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Embodiment Construction

[0056] figure 1 , figure 2 The first embodiment of the present invention shown is to use the processing roller 4 as the opposite electrode to transport the resin film F as the processing substrate in the arrow x direction, and at the same time make the discharge electrode of the present invention composed of one electrode member 6 A device for surface modifying the surface of the thin film F.

[0057] Above-mentioned electrode member 6 is in with figure 1 The cover members 7 and 8 are members having lengths in the direction perpendicular to the paper surface, that is, the width direction of the film F, and the cover members 7 and 8 are opposed to both sides of the electrode member 6, which will be described in detail later.

[0058] Further, a manifold 11 is fixed on the side opposite to the processing roller 4 across the electrode member 6 via an insulator 9 and a connecting member 10 fixed to a frame not shown.

[0059] A gas supply source (not shown) is connected to t...

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Abstract

To provide a surface modification device that achieves the desired surface modification while keeping the amount of substitution gas that is supplied low. This surface modification device forms a discharge area E1 between a discharge electrode 6 and a counter electrode 4, supplies substitution gas to the discharge area E1, and modifies the surface of the base material to be processed. The surfacemodification device comprises: a slit-shaped substitution gas passage; and cover members 7, 8 that form curtain passages 22, 23 in spaces facing the discharge electrode. While the substitution gas isbeing supplied to the discharge area E1, gas injected from the curtain passages 22, 23 prevent the inflow of an entrained flow a and the outflows b1, b2 of the substitution gas, thereby maintaining the concentration of substitution gas inside the discharge area E1.

Description

technical field [0001] The invention relates to a surface modifying device for modifying the surface of a treated base material by using discharge energy. Background technique [0002] As such a surface modifying device, a surface modifying device having a discharge electrode provided in an electrode chamber and a counter electrode facing the discharge electrode is known. Then, a replacement gas corresponding to the purpose of surface modification is supplied into the electrode chamber, and a voltage is applied to the discharge electrode while maintaining the electrode chamber in the atmosphere of the replacement gas, thereby generating discharge between the discharge electrode and the counter electrode. [0003] Also, the surface of the processing substrate interposed between the two electrodes is modified by the discharge energy. [0004] In such a surface modifying device, the type and concentration of the replacement gas in the discharge region affect the modified state...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J19/08H05H1/24
CPCB01J19/08H01J37/32018H01J37/3244B29C59/12H05H1/47H01J37/32073H01J37/32449H01J37/32568C08J7/123B01J19/088B29C71/04
Inventor 杉村智小木曾智樱井行平吉田纯也森下贵生
Owner KASUGA DENKI
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