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Method and system for moving a substrate

A mobile system and substrate technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of bulkiness and large size

Active Publication Date: 2020-04-17
APPL MATERIALS ISRAEL LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are no similar requirements for inspection systems, and conventional measurement / inspection systems can often be relatively bulky and can be of relatively large size

Method used

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  • Method and system for moving a substrate
  • Method and system for moving a substrate
  • Method and system for moving a substrate

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Experimental program
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Embodiment Construction

[0044] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

[0045] Any reference in the specification to a method shall apply mutatis mutandis to a system capable of performing said method.

[0046] Any reference to a system in the specification shall apply mutatis mutandis to methods executable by the system.

[0047] Assigning the same reference numbers to various components may indicate that the components are similar to each other.

[0048]There may be provided a small chamber, a system comprising the chamber, a method for moving a substrate within the chamber, and a method for evaluating the substrate while it is d...

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PUM

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Abstract

A method and a system for moving a substrate, the system includes a chamber, a chuck, a movement system that is positioned outside the chamber, a controller, an intermediate element, at least one sealing element that is configured to form a dynamic seal between the intermediate element and the chamber housing. The movement system is configured to repeat, for each region of the substrate out of a plurality of regions of the substrate, the steps of: rotating the chuck to position a given portion of the region of the substrate within a field of view that is related to an opening of the chamber housing; and moving the chuck relation to the opening to position additional portions of the region of the substrate within the field of view that is related to the opening.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Patent Application Serial No. 15 / 668,517, filed August 3, 2017, the contents of which are hereby incorporated by reference in their entirety middle. [0003] Background of the invention [0004] Integrated circuits are fabricated by building semiconductor devices on one or more substrates in a processing chamber. Semiconductor devices are interconnected to form an integrated circuit (IC). A semiconductor wafer may have one, perhaps many, or several ICs. [0005] Semiconductor devices are fabricated on a substrate (eg, a silicon wafer) by processes that involve depositing, patterning, and removing material on the substrate. [0006] Deposition processes such as chemical vapor deposition (CVD) or physical vapor deposition (PVD) may be used to deposit layers of material on the substrate. [0007] Photolithography techniques can be used to create patterns in layers of material t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68H01L21/687H01L21/66
CPCH01L21/67126H01L21/67167H01L21/67196H01L21/6719H01L21/67259H01L21/681H01L22/12H01L21/68714
Inventor 奥弗·阿丹伊斯拉埃尔·阿夫内里约拉姆·乌兹尔伊戈尔·克里夫茨(克莱维茨)尼兰詹·拉姆钱德拉·哈斯基瓦莱
Owner APPL MATERIALS ISRAEL LTD