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A kind of heat-dissipating coating and its preparation method and application

A technology of heat-dissipating coatings and dispersants, applied in the field of coatings, can solve problems such as large amount of addition, decline in the mechanical properties of electronic components, and affect the performance of electronic components, and achieve good heat dissipation performance and corrosion resistance.

Active Publication Date: 2022-03-22
GOERTEK INC
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] At present, inorganic fillers (boron nitride, aluminum oxide, etc.) are widely used to improve the thermal conductivity of electronic components, but due to the large amount of traditional inorganic fillers, it is easy to cause the mechanical properties of electronic components to decline and the appearance is poor, thereby affecting The use performance of electronic components; in addition, there are also coatings modified with carbon nanotubes (one-dimensional) and graphene (two-dimensional) to improve their heat dissipation performance, but due to the limitations of carbon nanotubes and graphene structures, the amount added Much larger than three-dimensional nanomaterials, and the thermal conductivity is generally below 2W / (m K), which will also affect the spraying effect of coatings

Method used

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  • A kind of heat-dissipating coating and its preparation method and application
  • A kind of heat-dissipating coating and its preparation method and application

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preparation example Construction

[0042] The present invention also discloses a preparation method of the above-mentioned heat-dissipating coating, including:

[0043] Mix the water-based resin and the solvent evenly to obtain mixture A;

[0044] Add solid solution to mixture A and mix uniformly to obtain mixture B;

[0045] A dispersant, a defoamer and a leveling agent are sequentially added to the mixture B, and the heat-dissipating coating is obtained after mixing and extruding several times.

[0046] Optionally, the solid solution is a graphene / carbon nanotube-loaded nano-copper-nickel solid solution, and the preparation method of the graphene / carbon nanotube-loaded nano-copper-nickel solid solution includes:

[0047] Add copper salt and nickel salt into distilled water, and ultrasonically dissolve to obtain a mixed salt solution;

[0048] Add graphene oxide and carbon nanotubes whose surface has been acidified to the mixed salt solution, and ultrasonically disperse them evenly to obtain a dispersion;

...

Embodiment 1

[0054] (1) 58.9g water-based epoxy resin is mixed with 40g ethanol to obtain mixture A;

[0055] (2) Add 0.2g graphene / carbon nanotube-loaded nano-copper-nickel solid solution to the mixture A of step (1), and mix uniformly to obtain mixture B;

[0056] (3) To the mixture B in step (2), add 0.3g each of the dispersant vinylbisstearamide, the water-based defoamer dimethyl silicone oil and the silicone-based water-based leveling agent in sequence, and place them in a three-roll mill , after three rollers and three times of mixed extrusion, the heat dissipation coating is obtained.

Embodiment 2

[0058] (1) 60g water-based epoxy resin is mixed with 38.2g ethanol to obtain mixture A;

[0059] (2) Add 0.3g graphene / carbon nanotube-loaded nano-copper-nickel solid solution to the mixture A of step (1), and mix uniformly to obtain mixture B;

[0060] (3) To the mixture B in step (2), add 0.5g each of the dispersing agent vinylbisstearamide, the water-based defoamer dimethyl silicone oil and the silicone-based water-based leveling agent, and place them in a three-roll mill , after three rollers and three times of mixed extrusion, the heat dissipation coating is obtained.

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Abstract

The invention discloses a heat-dissipating coating and its preparation method and application. The heat-dissipating coating comprises 30-60 parts of water-based resin, 0.2-1.5 parts of solid solution, 0.2-2 parts of dispersant, and 0.2 parts of leveling agent in parts by weight. -2 parts, 0.2-2 parts of defoamer, 30-40 parts of solvent, the thermal conductivity of the heat-dissipating coating is greater than 2.1W / (m·K). The heat dissipation coating has good heat dissipation performance and corrosion resistance, and has low solid solution content, simple composition, and environmentally friendly components, and is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to the technical field of coatings, in particular, the invention relates to a heat-dissipating coating and its preparation method and application. Background technique [0002] With the rapid development of electronic technology, electronic components and circuits tend to be more highly integrated and miniaturized. With the increasing integration and power of electronic and electrical equipment, the calorific value of electronic and electrical equipment has increased significantly, and the influence of temperature on the reliability of electronic and electrical equipment is as high as 60%. Studies have shown that the reliability of electronic components will decrease by 10% for every 2°C increase in temperature; the life of electronic components at 50°C is only 1 / 6 of that at 25°C. Therefore, improving the heat dissipation of electronic components is an urgent problem to be solved at present. [0003] At present, inorganic fille...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D163/00C09D175/04C09D5/10C09D7/62
CPCC09D163/00C09D175/04C09D5/10C09D7/62C08K2003/085C08K2003/0862C08K2201/011C08K9/12C08K3/08
Inventor 王淑敏于洋张晓婷
Owner GOERTEK INC
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