Application thermal remediation method and device

A technology of hot repair and waiting to be repaired, which is applied in the directions of instruments, electrical digital data processing, platform integrity maintenance, etc. The effect of good compatibility

Active Publication Date: 2020-04-28
BAIDU ONLINE NETWORK TECH (BEIJIBG) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, the real-time hot repair technology based on code repair has certain compatibility problems due to the replacement of logical fields or specific parameters of specific methods on the Andr

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  • Application thermal remediation method and device
  • Application thermal remediation method and device
  • Application thermal remediation method and device

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Embodiment Construction

[0028] The application will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the related invention, but not to limit the invention. In addition, it should be noted that, for ease of description, only the parts related to the relevant invention are shown in the drawings.

[0029] It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other if there is no conflict. Hereinafter, the present application will be described in detail with reference to the drawings and in conjunction with embodiments.

[0030] figure 1 An exemplary system architecture 100 of the applied thermal repair method or applied thermal repair device of the present application is shown.

[0031] Such as figure 1 As shown, the system architecture 100 may include terminal devices 101, 102, 103, a network 104, and a server 105. ...

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Abstract

The embodiment of the invention discloses an application hot repair method and device, electronic equipment and a computer readable medium. One specific embodiment of the application hot repair methodcomprises the steps that a hot repair plug-in of a to-be-repaired application is acquired, and the hot repair plug-in is generated by a patch file of the to-be-repaired application and a file loadingmethod used for loading the patch file to repair the to-be-repaired application; and the thermal repair plug-in and the patch file into the memory are loaded according to a file loading method obtained by loading the thermal repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing a to-be-repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting the file loading method. According to the embodiment, the host software development kit does not need to be updated in the repairing process, and non-perception hot repairing can be achieved; repairing is performed by replacing a data structure in a memory, so that good compatibility and a relatively high success rate can be achieved.

Description

Technical field [0001] The embodiments of the present application relate to the field of computer technology, in particular to the field of software repair technology, and in particular to an applied thermal repair method and device. Background technique [0002] The repair technology of Android applications is a technology that enables accurate implementation of application functions by repairing application vulnerabilities. Among them, the hot repair technology is a technology that does not need to reinstall the application software package during the repair process, and realizes the vulnerability repair technology by pulling the patch package. [0003] The current hot repair technology mainly adopts real-time hot repair technology based on code repair or cold start repair technology through the Java loading mechanism. Among them, the real-time hot repair technology based on code repair has certain compatibility issues due to the replacement of the logical fields or specific par...

Claims

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Application Information

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IPC IPC(8): G06F8/656G06F21/57
CPCG06F8/656G06F21/57Y02D10/00
Inventor 李双刘朋飞
Owner BAIDU ONLINE NETWORK TECH (BEIJIBG) CO LTD
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