Test tool for image sensor wafer detection

Abstract

The invention discloses a test tool for image sensor wafer detection, and relates to the technical field of wafer detection. The test tool comprises a supporting device, wherein rotating devices arranged at equal intervals are arranged above the supporting device, each rotating device comprises a cylinder, the outer surface of each cylinder is provided with a first sliding groove, and a first sliding block matched with the corresponding first sliding groove is slidably connected in each first sliding groove. According to the test tool for image sensor wafer detection, arc-shaped clamping plates are arranged, a wafer with a fixed size can be effectively clamped through the four arc-shaped clamping plates under the action of first springs, the wafer can automatically coincide with the circlecenter of tan outer frame body when the wafer is clamped by the four arc-shaped clamping plates through the arrangement of four groups of same first springs, and the problem that the circle center needs to be adjusted after the wafer is clamped is avoided.

Description

technical field [0001] The invention relates to the technical field of wafer inspection, in particular to a test tool for image sensor wafer inspection. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer and become an integrated circuit with specific electrical functions. circuit products. [0003] The size of existing wafers is generally fixed, such as 4 inches, 5 inches, 6 inches, 8 inches, etc. according to their diameters. Wafers need to undergo cutting, oxidation, heat treatment and grinding processes during the manufacturing process. It is necessary to inspect the surface quality after the manufacturing is completed, so as to avoid the waste of processing cost by reprocessing the waste wafers with cracks on the surface. Existing inspections on the upper su...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a test tool for image sensor wafer detection, which has the advantages of good wafer clamping effect and convenient wafer picking, and solves the problem of common clamping of existing tooling for wafer rotation. The effect is not good, and the problem of not being able to take the wafer conveniently

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