wafer carrier

A wafer carrying and vacuum device technology, which is applied in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as large bow value of the wafer, uneven wafer surface, adverse effects of semiconductor device manufacturing and testing, etc. , to achieve the effect of reducing the bow value

Active Publication Date: 2022-07-26
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, due to the warping of the wafer, the large bow value (bow) of the wafer leads to the unevenness of the wafer surface, which will have a negative impact on the manufacturing and testing of semiconductor devices.

Method used

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Embodiment Construction

[0019] The present invention will be described in more detail below with reference to the accompanying drawings. In the various figures, like elements are designated by like reference numerals. For the sake of clarity, various parts in the figures have not been drawn to scale. Additionally, some well-known parts may not be shown in the drawings.

[0020] Numerous specific details of the invention are described below, such as the construction of components, materials, dimensions, processing and techniques, in order to provide a clearer understanding of the invention. However, as can be understood by one skilled in the art, the present invention may be practiced without these specific details.

[0021] It will be understood that, in describing the structure of a component, when a layer or region is referred to as being "on" or "over" another layer or region, it can be directly on the other layer or region, or Other layers or regions are also included between it and another la...

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PUM

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Abstract

The present application discloses a wafer carrying device, comprising: a first support structure with a first support surface and a plurality of first suction holes; a plurality of spaced suction cups arranged on the first support structure, with for adsorbing the wafer placed on the first support surface; the vacuum device connected with the first adsorption hole and the suction cup makes the air pressure inside the first adsorption hole and the inner cavity of the suction cup a negative pressure; the first adsorption hole pressure regulating valve, It is arranged on the gas path between the first adsorption hole and the vacuum device; the suction cup pressure regulating valve is arranged on the gas path between the suction cup and the vacuum device, and the first vacuum hole pressure regulating valve and the first adsorption hole regulate the pressure The valves independently adjust the air pressure in the first adsorption hole and the air pressure in the cavity of the suction cup. Through the first suction hole pressure regulating valve and the suction cup pressure regulating valve, the suction strength of the suction hole and the suction cup to the wafer is precisely controlled, so that the suction cup reduces the wafer bow to ensure that the suction hole fixes the wafer, and does not The wafer will be damaged due to the excessive suction force of the suction cup.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more particularly, to a wafer carrier device. Background technique [0002] In the process of manufacturing and testing semiconductor devices, a wafer carrier needs to be used to fix the wafer. In the prior art, due to the warpage of the wafer, the unevenness of the wafer surface due to the large bow of the wafer will adversely affect the manufacture and inspection of semiconductor devices. Therefore, it is desirable to further improve the wafer carrier apparatus to improve the yield of semiconductor devices. SUMMARY OF THE INVENTION [0003] In view of the above problems, the purpose of the present invention is to provide a wafer carrier device, which can accurately control the suction strength of the suction holes and the suction cups to the wafer through the first suction hole pressure regulating valve and the suction cup pressure regulating valve, so that the suction cup...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687H01L21/683
CPCH01L21/6838H01L21/68714H01L21/68785
Inventor 陈辉张文杰杨震
Owner YANGTZE MEMORY TECH CO LTD
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