A computer chip cooling device

Abstract

The invention discloses a computer chip cooling device. The cooling device includes a liquid storage assembly, a cooling assembly and a pumping assembly. The liquid storage assembly is composed of a cooling surface and a heat dissipation surface; multiple heat dissipation packs are installed on the heat dissipation surface; each heat dissipation pack is used to hold the cold storage liquid injected into it in a controlled manner; the refrigeration assembly is arranged between the heat dissipation surface and the heat dissipation fan so that the cold storage liquid absorbs cold energy from the refrigeration assembly; the pumping assembly is configured to controlly pump the cold storage liquid in the refrigeration assembly to each heat dissipation pack, and pump the cold storage liquid in each heat dissipation pack to the refrigeration unit. in the component. The computer chip cooling device provided by the present invention uses double cooling, not only adopts the heat dissipation package to contain the cold storage liquid injected into it in a controlled manner, but also uses the content of the liquid storage component to store the cold storage liquid, so as to improve the heat dissipation efficiency.

Description

technical field [0001] The invention relates to the technical field of computer cooling, in particular to a computer chip cooling device. Background technique [0002] An important problem in high-power electronic equipment such as personal computers, workstations, and notebook computers is how to stabilize the chip at a reasonable operating temperature, even if the high-density heat generated by the chip can be dissipated quickly and effectively. The difficulty of cooling a tiny system such as a computer chip is that: for the existing cooling methods and architectures, firstly, excessively high cooling air velocity will cause large acoustic noise; secondly, the compactness of the electronic equipment architecture requires only It is allowed to reserve a limited cooling space; third, the installation of large-size heat sinks on the module should be avoided as much as possible. The above problems all illustrate the importance of developing high power density heat dissipation...

AI Technical Summary

Problems solved by technology

Although the water cooling method has a high heat dissipation efficiency, due to factors such as evaporation, condensation, and scale during operation, local components will be aged and corroded, so the requirements for water quality and pipelines are relatively high. In addition, poor sealing will lead to leakage. needs improvement

According to reports, the current water-cooling method is easy to burn the chip. The key reason is that the water-cooling system is not reliable. Once some faults cause the water circulation to stop, the heat generated by the chip cannot be discharged, and its temperature will rise rapidly until the chip is burned.

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