Packaging structure and packaging method of chip
A packaging method and packaging structure technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of difficult control of the dispensing process and high development costs
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[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0039] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but they must be based on what can be achieved by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that the combination of such technical solutions It does not exist and does not fall within the scope of protection claimed by the present invention.
[0040] In addition, the present invention provides a ...
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