Heat exchange amount adjusting method and device achieving continuous adjusting and semiconductor air conditioner
An adjustment method and semiconductor technology, applied in heating methods, air-conditioning systems, household heating, etc., can solve problems such as human discomfort and excessive temperature changes, and achieve the effect of improving comfort and avoiding excessive temperature changes
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Embodiment 1
[0059] This embodiment provides a continuously adjustable heat transfer adjustment method,figure 1 It is a flowchart of a method for adjusting heat transfer according to an embodiment of the present invention, such as figure 1 As shown, the method includes:
[0060] S101, acquiring the rate of change of the indoor ambient temperature;
[0061] In specific implementation, the indoor ambient temperature data can be acquired periodically according to the preset time interval Δt, and the indoor ambient temperature values obtained twice adjacently can be recorded as T1 and T2, then (T2-T1) / Δt is the rate of change of the indoor ambient temperature, and the rate of change is used to characterize the speed of the indoor ambient temperature change.
[0062] S102. Control the operating parameters of the semiconductor heat exchange module according to the change rate, so as to adjust the actual heat exchange amount.
[0063] During specific implementation, the semiconductor units in...
Embodiment 2
[0076] This embodiment provides another continuously adjustable heat transfer adjustment method, Figure 4 It is a schematic diagram of the structure of the semiconductor heat exchange module of the semiconductor air conditioner, such as Figure 4 As shown, the principle of its refrigeration is through the P-N junction of the semiconductor material, that is, the direct current applied to the two ends of the semiconductor unit 101, so that the cold end of the semiconductor unit 101 is refrigerated, the hot end is heated, and the cooling is released into the air by the fan 104. Realize refrigeration and convert electrical energy directly into heat energy. A P-type semiconductor element and an N-type semiconductor element are connected to form the semiconductor unit 101. After the DC power supply is connected, a temperature difference and heat transfer will occur at the joint. When the current flows from N→P, the joint will be Heat is absorbed to form a cold end 102; when the curr...
Embodiment 3
[0094] This embodiment provides a continuously adjustable heat transfer adjustment device, Figure 9 It is a structural diagram of a heat exchange regulating device according to an embodiment of the present invention, such as Figure 9 As shown, the device includes: a first acquisition module 11, configured to acquire the rate of change of the indoor ambient temperature, specifically for periodically acquiring indoor ambient temperature data, and recording the indoor ambient temperature values obtained twice adjacently as T1 and T2 , then (T2-T1) / △t is the rate of change of the indoor environment temperature, the rate of change is used to characterize the speed of the change of the indoor environment temperature; the first processing module 12 is used to control the semiconductor converter according to the rate of change The operating parameters of the thermal module are used to adjust the actual heat transfer, wherein the operating parameters include the number of openings ...
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