Parameter Identification Method of Power Module Thermal Network Model Based on Least Square Method
A technology of thermal network model and least squares method, applied in CAD network environment, special data processing applications, geometric CAD, etc., can solve the complex operation of extracting reduced-order model, the error of reduced-order model, and the thermal network model does not consider the heat between chips. Coupling effect and other problems, to achieve the effect of easy long-term chip temperature calculation and high precision
Active Publication Date: 2022-06-24
HEFEI UNIV OF TECH
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[0005] 1) The implementation process involves the initial finite element model, the finite element volume model and the new finite element model, and there are two mapping operations, and the operation of extracting the reduced-order model is complicated;
[0006] 2) The initial finite element model includes the heat dissipation system, and the new finite element model uses the convective heat transfer coefficient to model the actual heat dissipation system, which will cause large errors in the extracted reduced-order model
[0008] 1) The extracted thermal network model does not consider the thermal coupling effect between chips, and is not suitable for temperature estimation of multi-chip power modules;
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[0093] The present invention will be further described in detail below with reference to the accompanying drawings.
[0094] figure 2 is the structure diagram of the thermal network model involved in the identification method of the present invention, and is represented by figure 2 It can be seen that the thermal network model in the present invention includes 13 temperature nodes, 4 input loss current sources, 20 thermal conductances and 12 thermal capacitances; the 13 temperature nodes are denoted as temperature nodes N i , i is the serial number of the temperature node, i=1, 2...13, the temperature node N i The temperature is recorded as the temperature T i , i=1, 2...13; the 20 thermal conductivities are denoted as thermal conductance G j , j is the serial number of thermal conductivity, j=1,2...20; the 12 heat capacities are recorded as heat capacity C k , k is the serial number of heat capacity, k=1, 2...12; the four input loss current sources are respectively reco...
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The invention discloses a parameter identification method of a thermal network model of a power module based on a least square method. The heat network parameter identification method proposed by the invention uses the simulation results of several groups of finite element models to calculate the heat conduction of the heat network model and identify the heat capacity of the heat network model based on the principle of the least square method. The thermal network model parameter identification method of the present invention is simple in principle, and the extracted thermal network model has high precision, and can be applied to online calculation of chip temperature and calculation of chip temperature on a long-term scale.
Description
technical field [0001] The invention relates to a method for identifying parameters of a thermal network model of a power module, in particular to a method for identifying parameters of a thermal network model of a power module based on the least squares method. Background technique [0002] Industrial research has shown that the power module is the weakest component in a power electronic system. About 55% of power module failures are induced by temperature factors. The chip temperature estimation of the power module is the basis for life prediction and reliability evaluation. Thermal network models are widely used in industry for chip temperature prediction and estimation of power modules because they are easily embedded in digital signal processors and do not need to design additional hardware circuits. The finite element simulation model is often used to predict the chip temperature. The simulation results of the finite element simulation model have high accuracy but th...
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IPC IPC(8): G06F30/23G06F30/18G06F111/02G06F119/08
CPCG06F30/23G06F30/18G06F2111/02G06F2119/08
Inventor 马铭遥郭伟生严雪松杨淑英张兴
Owner HEFEI UNIV OF TECH