Substrate and lamp

A technology for substrates and lamps, which is applied to cooling/heating devices of lighting devices, lighting devices, instruments, etc., and can solve the problems of large substrate thickness and low space utilization

Pending Publication Date: 2020-09-04
OPPLE LIGHTING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to further enhance the heat dissipation efficiency of the substrate, in the traditional technology, the substrate is often designed as a structure in which a thicker plastic shell wraps metal components, which can effectively dissipate heat to the outside. low utilization

Method used

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  • Substrate and lamp
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Embodiment Construction

[0028] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0029] The embodiment of the present application provides a substrate, such as figure 1 and figure 2 As shown, it can be a substrate used to fix light-emitting components in a flat light source, a substrate used to fix electronic components in a computer, or a substrate used to fix liquid crystal components in a display screen, etc., such as figur...

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Abstract

The embodiment of the invention provides a substrate and a lamp. The substrate comprises a main plate and a thermal radiation coating. The main plate is made from metal. The main plate is provided with a heat dissipation surface for heat dissipation. The thermal radiation coating covers the heat dissipation surface. The thermal radiation coefficient of the thermal radiation coating is higher thanthe thermal radiation coefficient of the main plate. Since the main plate made from metal and the thermal radiation coating with the higher heat radiation coefficient than the main plate are combinedwith each other, on the premise of utilizing high heat conductivity and good uniform thermal performance of the main plate, the thin thermal radiation coating is in fit with the main plate, and the heat dissipation performance of the substrate is ensured without increasing the thickness too much.

Description

technical field [0001] The invention relates to the field of heat dissipation equipment, in particular to a substrate and a lamp. Background technique [0002] For electrical appliances such as lamps and tablet computers, the heat dissipation performance is more important. Therefore, when designing electrical appliances such as lamps and tablet computers, components with high heat generation such as LED light sources and electronic components are often bonded to a substrate. The main body of the substrate is made of metal. Made of metal, using the advantages of fast heat conduction and strong heat uniformity of metal to improve heat dissipation efficiency. [0003] In order to further enhance the heat dissipation efficiency of the substrate, in the traditional technology, the substrate is often designed as a structure in which a thicker plastic shell wraps metal components, which can effectively dissipate heat to the outside. Utilization is low. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/87F21V29/89G06F1/20
CPCF21V29/87F21V29/89G06F1/20
Inventor 李朝广韩剑平吴琳娜肖柳华杨巍巍
Owner OPPLE LIGHTING
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