Packaging structure and manufacturing method thereof

Abstract

The invention provides a packaging structure. The packaging structure comprises a substrate, at least two radio frequency chip modules, a plastic packaging body, a groove, a solder filling body and ashielding layer, wherein a solid grounding copper sheet layer is arranged on the substrate; the at least two radio frequency chip modules are arranged on the substrate; the plastic package body is arranged on the substrate and covers the surface of the substrate, and the at least two radio frequency chip modules are wrapped in the plastic package body; the groove is located between two adjacent radio frequency chip modules and penetrates through the upper surface and the lower surface of the plastic package body; the groove is filled with the solder filling body, and the upper surface of the solder filling body is leveled with the upper surface of the plastic package body; the shielding layer covers the upper surface and the side surface of the plastic package body, the upper surface of the solder filling body and the side surface of the substrate; the position of the solid grounding copper sheet layer corresponds to the position of the groove, and the solid grounding copper sheet layer makes contact with the solder filling body in the groove.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging, in particular to an electromagnetic interference shielding system packaging structure. Background technique [0002] In the SiP manufacturing process of electronic system-level packaging, with the miniaturization of package size, it requires digital circuits, analog circuits, and radio frequency circuits to be integrated in one system. The combination of different chips in the system, when the distance between chips is too close , crosstalk will occur, especially high-frequency analog chips, whose reliability is often subject to electromagnetic interference. At present, there is an urgent need to develop an electromagnetic interference shielding packaging structure to adapt to the trend of miniaturization of product development. Contents of the invention [0003] An embodiment of the present invention provides a packaging structure, including: a substrate, at least two radio frequenc...

AI Technical Summary

Problems solved by technology

[0002] In the SiP manufacturing process of electronic system-level packaging, with the miniaturization of package size, it requires digital circuits, analog circuits, and radio frequency circuits to be integrated in one system. The combination of different chips in the system, when the distance between chips is too close , crosstalk will occur, especially high-frequency analog chips, whose reliability is often subject to electromagnetic interference. At present, there is an urgent need to develop an electromagnetic interference shielding packaging structure to adapt to the trend of miniaturization of product development

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