Automatic positioning device for ultra-pure aluminum sputtering target material
A sputtering target, automatic positioning technology, applied in sputtering coating, metal material coating process, ion implantation coating and other directions, can solve the problems of processing flow, inability to grasp, low grasping efficiency of manipulators, etc. , to achieve the effect of improving the grabbing efficiency and smooth grabbing
Inactive Publication Date: 2020-10-09
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology
[0003] In the prior art, the action of grabbing with the manipulator needs to be done manually. The manipulator has a fixed grabbing action and grabbing point, and the target is manually handed over to the manipulator, so that the manipulator can perform subsequent operations after grabbing; in manual operation, If there is a slight deviation in the position of the target, the manipulator may not be able to grab the target. At this time, it is necessary to manually adjust the position of the target until the target is aligned with the position of the manipulator. Grab the position so that the manipulator grabs the target; and in the process of manually adjusting the position of the target, it is necessary to avoid bumps and reduce target damage, and manual adjustment requires enough time, which makes The gripping efficiency of the manipulator is very low, which affects the entire processing process
Method used
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[0021] At present, the target material is manually delivered to a position where the manipulator can grasp it to assist the grasping operation of the manipulator, so that the target material can be processed subsequently.
[0022] According to the inventor's analysis and research, the position of the grasping target set by the manipulator is fixed. If the target can be successfully grasped by the manipulator, manual operation is required, and the manpower needs to accurately grasp the target. Place it in an appropriate position to assist the grasping of the manipulator; if the operator places it in an improper position, the manipulator cannot grasp it.
[0023] According to the analysis and research of the inventors, during manual transfer, it is impossible to effectively ensure that the position of the target can be placed quickly and accurately so that the manipulator can grasp it smoothly. It is necessary to provide an area that can be accurately identified and grasped by th...
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Abstract
The invention discloses an automatic positioning device for an ultra-pure aluminum sputtering target material. The automatic positioning device comprises a storage platform, a containing area is arranged on the storage platform, the containing area is composed of a supporting base / supporting bases and limiting columns, and the supporting base / supporting bases is / are located in the containing areaand used for supporting a target object; the limiting columns are used for limiting the position of the target object; and the containing area is an area which can be accurately recognized and grabbedby a mechanical arm, that after the target material is placed in the area, the mechanical arm can smoothly grab the target material can be guaranteed, thus labor is liberated, and the efficiency is improved.
Description
technical field [0001] The invention relates to the field of semiconductor target processing, in particular to an automatic positioning device for an ultra-high-purity aluminum sputtering target. Background technique [0002] In the process of processing the semiconductor target, it has to go through multiple processes. Before processing the semiconductor target, the semiconductor target needs to be transported to the processing area for processing; usually after the target is grasped by the robot, it is Subsequent processing. [0003] In the prior art, the action of grabbing with the manipulator needs to be done manually. The manipulator has a fixed grabbing action and grabbing point, and the target is manually handed over to the manipulator, so that the manipulator can perform subsequent operations after grabbing; in manual operation, If there is a slight deviation in the position of the target, the manipulator may not be able to grab the target. At this time, it is neces...
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IPC IPC(8): C23C14/34B25B11/00
CPCB25B11/00C23C14/3407
Inventor 姚力军潘杰王学泽魏小林
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD