Electroplating system and electroplating method
A technology of electroplating and electroplating tank, which is applied in the field of semiconductors, can solve the problems of uneven thickness, lack of tin, and inability to discharge, etc., and achieve the effect of uniform coating thickness
Active Publication Date: 2020-10-30
SIPLP MICROELECTRONICS CHONGQING CO LTD
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[0004] However, since the liquid medicine is easily mixed with air when it is sprayed to a high altitude, when the liquid medicine with air hits the large plate, bubbles will accumulate on the surface of the large plate and cannot be discharged, and the area where the air bubbles are formed cannot be in contact with the liquid medicine. There is no deposition, resulting in problems such as uneven thickness or lack of tin
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[0042] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.
[0043] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. Unless otherwise defined, the technical terms or scientific terms used in the present application shall have the common meanings understood by those skilled in the art to which the present invention belongs. Words such as "one" or "o...
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The invention provides an electroplating system and an electroplating method. The electroplating system comprises a to-be-electroplated part, an electroplating bath and a liquid nozzle, wherein the liquid nozzle is located in the electroplating bath and used for spraying electroplating liquid to the to-be-electroplated part, at least part of the to-be-electroplated part is located in the electroplating bath, and a first included angle is formed between the to-be-electroplated part and a horizontal plane. The electroplating method comprises the steps that the to-be-electroplated part is placedin the electroplating bath, and the first included angle is formed between the to-be-electroplated part and the horizontal plane; and the to-be-plated part is electrified, and the electroplating liquid is sprayed to the to-be-plated part through the liquid nozzle, and the outer periphery of the to-be-plated part is coated with the electroplating liquid to complete an electroplating process. Bubbles in the electroplating liquid attached to the surface of the to-be-plated part can be reduced, and therefore, the effects that the whole surface of the to-be-plated part is plated with a plating layer, and the thickness of the plating layer is uniform are achieved.
Description
technical field [0001] The present application relates to the technical field of semiconductors, in particular to an electroplating system and an electroplating method. Background technique [0002] In the prior art, during the tinning process of large board products, bubbles are easily generated, resulting in problems such as uneven thickness of the coating and lack of tinning. [0003] During the tinning process, the electroplating solution is located at the bottom of the electroplating tank, the large board is placed vertically in the tank, and the large board is energized. The potion is sprayed vertically from the liquid nozzle to the direction of the large plate to realize electroplating. [0004] However, since the liquid medicine is easily mixed with air when it is sprayed to a high altitude, when the liquid medicine with air hits the large plate, bubbles will accumulate on the surface of the large plate and cannot be discharged, and the area where the air bubbles ar...
Claims
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IPC IPC(8): C25D5/08
CPCC25D5/08
Inventor 陈莉霍炎
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD