Auxiliary material taking mechanism for wafer placing box
An auxiliary mechanism and wafer technology, which is applied in the manufacture of conveyor objects, electrical components, semiconductor/solid-state devices, etc., can solve the problems of touch and grasping accuracy that cannot meet the requirements and affect production
Pending Publication Date: 2020-11-10
台州市老林装饰有限公司
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Problems solved by technology
[0002] The existing wafers generally need to be placed on the storage rack during processing, and then grasped by the grasping mechanism. Since the distance between the wafers placed up and down is relatively small, the height of the grasping mechanism The adjustment accuracy must be very high, otherwise it is easy to touch the rest of the wafers when grasping. However, when there is damage or other problems inside the wafer, the touch will occur when the grasping accuracy cannot meet the requirements, affecting production
Method used
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Embodiment
[0016] Example: see Figures 1 to 3 As shown, a kind of auxiliary mechanism for picking up materials in a wafer feeding box includes an installation horizontal plate 10, the left top surface of the top surface of the installation horizontal plate 10 is fixed with a connecting plate 11, and the front part of the top surface of the connecting plate 11 and the rear are fixed with side fixing plates 12, and the inner side walls of the two side fixing plates 12 are formed with front and rear corresponding placement grooves 13, and the wafer 100 is placed in the corresponding two placement grooves 13; The right end of the plate 12 is formed with a relatively extended arc portion;
[0017] The top surface of the right side of described installation horizontal board 10 is fixed with vertical support frame 20, and the left side wall of the vertical main board of vertical support frame 20 is fixed with linear motor 21, and is fixed with on the sliding block 22 of linear motor 21. Suppo...
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The invention discloses an auxiliary material taking mechanism for a wafer placing box, and the mechanism comprises a mounting horizontal plate; a connecting plate is fixed to the top surface of the left portion of the top surface of the mounting horizontal plate, side fixed plates are fixed to the front portion and the rear portion of the top surface of the connecting plate, and placing grooves corresponding front and back are formed in the inner side walls of the two side fixed plates; and the wafers are placed in the two corresponding placing grooves. According to the invention, the wafer can be automatically pushed outwards, the grabbing mechanism can conveniently and directly grab the wafer without touching other wafers, so the wafer does not touch other wafers when a certain error exists during material taking, and the processing effect is ensured.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, and more specifically relates to an auxiliary mechanism for retrieving materials from a wafer feeding box. Background technique [0002] The existing wafers generally need to be placed on the storage rack during processing, and then grasped by the grasping mechanism. Since the distance between the wafers placed up and down is relatively small, the height of the grasping mechanism The adjustment accuracy must be very high, otherwise it is easy to touch other wafers during grasping. However, when there is damage or other problems inside the wafer, the touch will occur when the grasping accuracy cannot meet the requirements, affecting production. Contents of the invention [0003] The purpose of the present invention is to address the deficiencies of the prior art, and to provide an auxiliary mechanism for loading and unloading wafers, which can automatically push the wafers ou...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/673H01L21/677
CPCH01L21/6732H01L21/67766H01L21/67775
Inventor 罗永胜
Owner 台州市老林装饰有限公司