A kind of computer motherboard with heat dissipation structure

Abstract

The embodiment of the present invention relates to the field of computer motherboards, and specifically discloses a computer motherboard with a heat dissipation structure, including a support frame and a computer motherboard body; the upper surfaces of both sides of the support frame along its length direction are fixedly provided with support columns, so The top of the support column has a step that supports and fixes an installation platform, and the installation platform is provided with an adjustment assembly for adjusting the position of the installation assembly; the middle part of the installation platform is provided with a ventilation channel, and the ventilation channel A protective net is arranged on the top, and an exhaust fan is arranged at the lower part of the exhaust passage. The embodiment of the present invention can install and fix the main board body of the computer through the installation assembly; through the mutual cooperation of the exhaust fan, the micro-air pump, the rotating disk, the air outlet channel and the air blowing port, the air flow near the main board body of the computer can be increased to improve the performance of the computer. The heat dissipation effect of the motherboard body.

Description

technical field [0001] The embodiment of the present invention relates to the field of computer motherboards, in particular to a computer motherboard with a heat dissipation structure. Background technique [0002] With the continuous development of the information age, computers have gradually become more important equipment in people's lives, and computers are assembled from a variety of hardware, including computer motherboards and other components, and the motherboards in existing computers are in If the heat generated during the working process is not dissipated in time, it will affect the normal use of the computer motherboard. [0003] For example, the Chinese patent whose authorization notification number is CN210488473U discloses a fast cooling device for computer motherboards, including a case, a micro-motor and a fixed block, the outer end of the case is threaded with a protective block, and the outer end of the protective block A filter screen is installed on th...

AI Technical Summary

Problems solved by technology

The computer motherboard hardware heat dissipation processing device easily leads to small heat dissipation area and uneven heat dissipation, which leads to poor heat dissipation effect and increases the possibility of the motherboard being burned out due to overheating, so it needs to be improved.

[0006] As can be seen from the above, the heat dissipation structure of the computer motherboard provided in the prior art still has a relatively single heat dissipation method, which cannot improve the air flow effect on the surface of the computer motherboard, resulting in the problem of poor heat dissipation effect of the computer motherboard, and uneven heat dissipation is prone to occur. , increasing the possibility of the motherboard being burned out due to overheating, therefore, it is urgent to design a computer motherboard with a heat dissipation structure

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