Computer mainboard with heat dissipation structure

Abstract

The embodiment of the invention relates to the field of computer mainboards, and particularly discloses a computer mainboard with a heat dissipation structure, which comprises a support frame and a computer mainboard body, support stand columns are fixedly arranged on the upper surfaces of the two sides of the support frame in the length direction of the support frame, a mounting platform is fixedly arranged at the position of step at the top end of the support stand columns in a supporting mode, and an adjusting assembly used for adjusting the position of the mounting assembly is arranged onthe mounting platform. An air draft channel is formed in the middle of the mounting platform, a protective net is arranged at the top of the air draft channel, and an air draft fan is arranged on thelower portion of the air draft channel. According to the embodiment of the invention, the computer mainboard body can be mounted and fixed through the mounting assembly; and through mutual cooperationof an exhaust fan, a micro air pump, a rotating disc, an air outlet channel and an air blowing opening, air flow near the computer mainboard body can be increased, so that the heat dissipation effecton the computer mainboard body is improved.

Description

technical field [0001] The embodiment of the present invention relates to the field of computer motherboards, in particular to a computer motherboard with a heat dissipation structure. Background technique [0002] With the continuous development of the information age, computers have gradually become more important equipment in people's lives, and computers are assembled from a variety of hardware, including computer motherboards and other components, and the motherboards in existing computers are in If the heat generated during the working process is not dissipated in time, it will affect the normal use of the computer motherboard. [0003] For example, the Chinese patent whose authorization notification number is CN210488473U discloses a fast cooling device for computer motherboards, including a case, a micro-motor and a fixed block, the outer end of the case is threaded with a protective block, and the outer end of the protective block A filter screen is installed on th...

AI Technical Summary

Problems solved by technology

The computer motherboard hardware heat dissipation processing device easily leads to small heat dissipation area and uneven heat dissipation, which leads to poor heat dissipation effect and increases the possibility of the motherboard being burned out due to overheating, so it needs to be improved.

[0006] As can be seen from the above, the heat dissipation structure of the computer motherboard provided in the prior art still has a relatively single heat dissipation method, which cannot improve the air flow effect on the surface of the computer motherboard, resulting in the problem of poor heat dissipation effect of the computer motherboard, and uneven heat dissipation is prone to occur. , increasing the possibility of the motherboard being burned out due to overheating, therefore, it is urgent to design a computer motherboard with a heat dissipation structure

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