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Circuit board and manufacturing method thereof, electronic device

A manufacturing method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problem that the ink of the circuit board is easy to bulge and foam, and achieve the effect of eliminating foaming and improving adhesion

Active Publication Date: 2021-07-27
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on the clearance requirement of the antenna, the area where the antenna is installed on the circuit board generally does not have metal lines or metal holes except for the antenna coil. Since there are not too many vias or other lines in the clearance area, the ink on the circuit board is easy to bulge and bubble.

Method used

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  • Circuit board and manufacturing method thereof, electronic device
  • Circuit board and manufacturing method thereof, electronic device
  • Circuit board and manufacturing method thereof, electronic device

Examples

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Embodiment Construction

[0025] The application will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0026] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understoo...

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PUM

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Abstract

An embodiment of the present application provides a circuit board, the circuit board includes a base material and a first ink layer, the base material includes a first surface and a second surface, the base material is provided with a plurality of through holes, the A patterned metal layer is formed on the first surface; the first ink layer is formed on the first surface and covers the plurality of through holes and at least part of the patterned metal layer; wherein, the inside of the through hole At least part of the space is filled with the first ink layer. In the circuit board provided by the embodiment of the present application, a patterned metal layer and a first ink layer are formed on the substrate, and a plurality of through holes are opened, and at least part of the space of the through holes is covered by the first ink layer, so that the through holes A certain grasping stress can be provided to the first ink layer, thereby improving the adhesion of the first ink layer, so as to reduce or eliminate ink bulges formed on the first surface of the circuit board.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a circuit board, a manufacturing method thereof, and electronic equipment. Background technique [0002] There are many ways to form the antenna, one of which is to design the copper pattern on the circuit board. First, the circuit board is used to make a coil on the circuit board to realize the antenna function. Based on the clearance requirement of the antenna, the area where the antenna is installed on the circuit board generally does not have metal lines or metal holes except for the antenna coil. Since there are not too many vias or other lines in the clearance area, the ink on the circuit board is easy to bulge and bubble. . Contents of the invention [0003] An embodiment of the present application provides a circuit board on the one hand, the circuit board includes a substrate and a first ink layer, the substrate includes a first surface and a s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/28
CPCH05K1/02H05K3/285
Inventor 刘幕俊
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD