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A locking release device based on sma

A technology of locking and releasing and biasing springs, which is applied to the docking devices of space vehicles, transportation and packaging, and space navigation equipment. Effect

Active Publication Date: 2022-03-01
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
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Problems solved by technology

[0004] However, existing SMA-based lock releases take up more space when connected to external devices than other equivalently sized connection releases

Method used

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  • A locking release device based on sma
  • A locking release device based on sma
  • A locking release device based on sma

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Embodiment Construction

[0025] The embodiments will be described in detail hereinafter, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following examples do not represent all implementations consistent with this application. These are merely examples of systems and methods consistent with aspects of the present application as recited in the claims.

[0026] SMA material is a material with shape memory properties composed of two or more metal elements. At a certain temperature, a thermoelastic martensitic transformation occurs inside the SMA material, causing the SMA material to deform. Take the wire made of SMA material as an example. When the temperature rises, this wire shortens in length, and when it cools, it returns to its original shape. The SMA material can be used ...

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Abstract

The present application provides an SMA-based locking release device, which includes a central body, a first pushing body, a second pushing body and a shrinking wire. The first pushing body and the second pushing body are located on the central body, a through hole with a chamfered structure is formed between the semicircular structures on the first pushing body and the second pushing body, and the locking body passes through the through hole. One shrinkage wire passes through the first driving body and the central body in a U shape, and the other shrinking wire passes through the second driving body and the central body in a U shape. Bias springs are arranged between the center body and the first push body, and between the center body and the second push body. The shrinking wire in this application is made of SMA material, which can be controlled by temperature to shrink or enlarge, so that the shrinking wire can generate tension on the first pusher and the second pusher, when the first pusher and the second pusher are separated , the perforation becomes larger and unlocking is completed. Compared with the traditional SMA-based locking and releasing device, under the same size, the space utilization rate is improved, and the locking function is stronger.

Description

technical field [0001] The present application relates to the technical field of locking and releasing devices, and in particular to an SMA-based locking and releasing device. Background technique [0002] The lock release device is divided into pyrotechnic lock release device and non-pyrotechnic lock release device. Among them, the most common lock release device is the pyrotechnic lock release device, which uses the gas expansion generated by the explosion of gunpowder to break the connecting parts and realize the release function. However, the pyrotechnic locking release device will produce pollutants during the release process, and cannot be repeatedly tested and used. Therefore, the non-pyrotechnic locking release device has become a research hotspot in the field of spacecraft devices. [0003] The lock release device based on shape memory alloys (SMA) is a kind of non-pyrotechnic lock release device. By using the tension generated by the SMA heated back to its origina...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B64G1/64
CPCB64G1/645B64G1/64
Inventor 宋迪鲁友均刘犇张德明贺中中
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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