Cake feeding mechanism in semiconductor packaging equipment
A technology of semiconductors and material cakes, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of reduced production efficiency of semiconductor products, difficulty in keeping up with equipment production speed, product packaging failure, etc., to improve product quality, The effect of reducing the chance of unpackaged products and reducing the requirements for manual operation
Active Publication Date: 2020-12-11
深圳市曜通科技有限公司
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Problems solved by technology
However, there are many problems in the manual feeding method. With the improvement of equipment production efficiency, it is difficult for manual feeding to keep up with the production speed of the equipment, resulting in a decrease in the overall production efficiency of semiconductor products, and manual feeding is prone to leakage of plastic packaging materials. , resulting in product package failure
Method used
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Embodiment 1
[0038] Please refer to Figure 1 to Figure 10 , Embodiment 1 of the present invention is: a feeding cake mechanism in semiconductor equipment, which can automatically load cylindrical molding compound into the barrel 46 on the feeding cake rack 41, greatly improving the loading of semiconductor packaging equipment. Material speed, while reducing possible errors in manual operations, reduce the labor intensity of workers.
[0039] Such as figure 1 with figure 2 As shown, the feeding cake mechanism in the semiconductor equipment includes a frame 1, and the frame 1 is provided with a feeding device 2, a feeding device 3 and a feeding platform 4, wherein the feeding device 3 is movably arranged on On the first mechanical arm 5 arranged along the X-axis direction, the loading platform 4 is movably arranged on the second mechanical arm 6 arranged along the Y-axis direction, the first mechanical arm 5 and the second mechanical arm 6 are all fixed in the frame 1. It also includes...
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The invention discloses a cake feeding mechanism in semiconductor equipment, which comprises a rack. A feeding device, a feeding device communicated with the feeding device and a feeding platform matched with the feeding device are arranged on the rack, the feeding device is slidably arranged on a first mechanical arm arranged along an X axis. The feeding device comprises a feeding pipe communicated with the feeding device and a feeding air cylinder driving the feeding pipe to slide on the Z axis, the feeding platform is arranged on a second mechanical arm arranged along the Y axis in a sliding mode, the feeding platform comprises a guide plate and a bottom plate arranged on the guide plate in a sliding mode, and the guide plate is provided with a guide groove formed in the sliding direction of the bottom plate. The guide groove comprises a linear section and an inclined section, the linear section and the inclined section are connected through an arc section, a mounting block is arranged on the side face of the bottom plate, a rotating piece matched with the guide groove is arranged on the mounting block, the bottom plate is rotationally connected with the second mechanical arm, acake feeding frame is arranged on the bottom plate, and a discharging opening corresponding to the guide plate is formed in the rack. And the automatic release of the molding compound is realized.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging equipment, in particular to a cake loading mechanism in semiconductor equipment. Background technique [0002] In the packaging process of semiconductors, the way to put the molding compound into the packaging equipment is usually to manually put the cylindrical molding compound into the barrel on the feeding cake rack in an orderly manner, and then put the feeding cake rack into packaged device. However, there are many problems in the manual feeding method. With the improvement of equipment production efficiency, it is difficult for manual feeding to keep up with the production speed of the equipment, resulting in a decrease in the overall production efficiency of semiconductor products, and manual feeding is prone to leakage of plastic packaging materials. , resulting in product packaging failure. Therefore, in order to improve the production efficiency of semiconductor packagi...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 鲍永峰
Owner 深圳市曜通科技有限公司