A kind of epoxy structural adhesive and its preparation method and application

Abstract

The invention relates to an epoxy structural adhesive, a preparation method and application thereof. The raw material composition of the epoxy structural adhesive includes: 50%-90% epoxy resin, 2%-10% catalyst, 0.01%-0.05% defoamer, 2%-7% white carbon black, 10-10% 50% filler and 0.3%‑0.7% carbon black; epoxy resins include silicone modified epoxy resins, bisphenol F epoxy resins and alkyl modified toughened epoxy resins. The invention also provides a preparation method of the above-mentioned structural adhesive. The epoxy structural adhesive has high elongation, adhesive force, and strong temperature and humidity resistance, and can be used for packaging and bonding devices.

Description

A kind of epoxy structural adhesive and its preparation method and application technical field The present invention relates to a kind of structural adhesive, relate in particular to a kind of epoxy structural adhesive with high elongation and adhesive force, belong to in the technical field of epoxy resin materials. Background technique According to Moore's Law, the number of transistors on a chip doubles every 18 months, which makes the microchip Lots of development. The improvement of computing efficiency per unit area must be accompanied by higher requirements for heat dissipation, so as to maintain the performance stability. Using the metal back cover to dissipate the heat generated by the chip is a very mature and effective method in the industry. pathway, as shown in Figure 1. The thermal interface material (TIM) is the key to connecting the chip and the heat dissipation top cover to ensure that the heat is dissipated. It can be a silicone-based thermally...

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Problems solved by technology

But at present, the adhesive force of the silicone system is not enough, and the ability of acrylic acid to withstand high temperature and high humidity is weak, and the traditional epoxy cannot achieve high elongation.

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