Film sheet thermocompression bonding method and system
A film and film technology, which is applied in the field of film thermocompression method and system, can solve the problems of easy sticking of hot melt adhesive, peeling failure of epitaxial layer, etc., and achieve the effect of controllable size and area and prevention of failure
Pending Publication Date: 2020-12-29
紫石能源有限公司
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is that the existing thin film thermocompression bonding method and system tend to have hot melt adhesive on the chamfer of the substrate structure, resulting in the failure of subsequent epitaxial layer peeling
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[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0038] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically conn...
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The invention relates to the technical field of thermocompression bonding of film sheets, in particular to a film sheet thermocompression bonding method and system, and the film sheet thermocompression bonding method comprises the following steps: S1, stripping bottom release paper of double-layer release paper; S2, cutting the hot melt adhesive layer of the double-layer release paper in a presetshape to form a gluing area and a separation area; S3, stripping the separation area from the top release paper of the double-layer release paper, leaving the gluing area on the top release paper, andseparating the separation area from the gluing area; S4, conducting thermocompression bonding on the gluing area and the surface of a substrate structure; S5, stripping the release paper on the top layer; and S6, carrying out thermocompression bonding on the high-molecular polymer film and the bonding area on the substrate structure. According to the invention, the hot pressing of the gluing areaand the substrate structure is realized, and the top release paper is stripped, so that the substrate structure locally covered with a hot melt adhesive is obtained, the problem that the hot melt adhesive is laminated at the chamfer of the substrate structure is effectively solved, and the failure of subsequent epitaxial layer stripping is prevented.
Description
technical field [0001] The invention relates to the technical field of thermocompression bonding of film sheets, in particular to a method and system for thermocompression bonding of film sheets. Background technique [0002] The epitaxial layer lift-off technology is a common technology to achieve film layer separation in the semiconductor industry. The lift-off technology includes mechanical lift-off, laser lift-off and wet etching lift-off, etc. The thickness of the epitaxial layer is generally only a few microns thick. In order to facilitate the subsequent process after peeling off, it is necessary to cover the epitaxial layer with a layer of polymer film as a supporting substrate before peeling off, so as to facilitate the subsequent process. conduct. In a conventional process, the material selected for bonding the polymer film and the epitaxial layer is pressure-sensitive adhesive or hot-melt adhesive. A layer of hot melt adhesive is coated on the high molecular poly...
Claims
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Login to View More IPC IPC(8): B32B37/10B32B37/06B32B37/00B32B38/00B32B38/18B32B43/00
CPCB32B37/10B32B37/06B32B37/0053B32B37/0076B32B38/0004B32B38/1858B32B38/185B32B43/003
Inventor 兰立广刘香廷严静融
Owner 紫石能源有限公司