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Aluminum alloy cladding material

一种包覆材、铝合金的技术，应用在金属加工、运输和包装、金属加工设备等方向，能够解决MgO皮膜生长、接合阻碍等问题

Active Publication Date: 2021-01-05
MA ALUMINUM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the typical connector-shaped tubes and fin junctions of general heat exchangers such as condensers and evaporators are easily affected by the atmosphere, and the MgO film tends to grow on the surface of the Mg-added brazing filler metal.
Since the MgO film is a stable oxide film that is not easily decomposed, bonding is significantly hindered

Method used

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  • Aluminum alloy cladding material
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  • Aluminum alloy cladding material

Examples

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Embodiment 1

[0140] For various aluminum alloy cladding materials with the compositions shown in Tables 1 to 3 and Tables 5 to 7 (the balance is Al and unavoidable impurities), casting conditions and homogenization conditions shown in Table 9 ( Brazing material) and hot-rolled sheets were produced under hot-rolled conditions. In addition, "-" in a component shows that content is 0 or the amount of unavoidable impurity.

[0141] Then, by cold rolling including an intermediate annealing step, a cold-rolled sheet having a thickness of 0.30 mm in the H14 equivalent temper was fabricated. It should be noted that the covering ratio of each layer was 10% for the sacrificial material and 8% for the solder.

[0142] In addition, corrugated fins of JIS A3003 alloy and H14 aluminum bare material (thickness 0.06 mm) were prepared as brazing target members.

[0143] Use the aluminum alloy cladding material to make a tube with a width of 25 mm, and combine the tube and the corrugated fins to form the ...

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Abstract

The present invention provides an aluminum alloy cladding material for stably brazing in a non-flux-free manner. The Al-Si-Mg-Bi solder comprises Si: 6.0-14.0%, Mg: 0.05-1.5%, Bi: 0.05-0.25%, Sr 0.0001-0.1%, and the balance Al and unavoidable impurities in terms of mass%. (Bi + Mg)*SR=0.1, Mg-Bi compounds contained in Al-Si-Mg-Bi solder, in the observation of the surface orientation prior to brazing, a Mg-Bi compound having a diameter of more than 0.1 mum and less than 5.0 mum in an equivalent circular diameter is more than 20 in each 10000 mum 2 field of view, the Mg-Bi compound having a diameter of 5.0 mum or more in the field of view of each 10000 mum is less than 2, the core contains Mn: 0.9-1.7%, Si: 0.2-1.0%, Fe: 0.1-0.5%, Cu: 0.08-1.0%, and the balance consisting of Al and unavoidable impurities.

Description

technical field [0001] The present invention relates to an aluminum alloy cladding material for flux-free brazing that joins without flux. Background technique [0002] With regard to heat exchangers for automobiles made of aluminum such as condensers and evaporators, aluminum materials have become thinner and stronger as they have been reduced in size and weight. In the manufacture of aluminum heat exchangers, brazing is performed to join the connectors (joints, joints). The reaction becomes inert and brazing defects tend to occur, so the use of Mg-added high-strength parts is limited. Therefore, a brazing method for joining Mg-added aluminum alloys without using flux is desired. [0003] In flux-free soldering using Al-Si-Mg solder, the Al oxide film (Al 2 o 3 ) undergo reductive decomposition to join. In a closed surface joint connector or the like, a connector in which brazing sheets with brazing material are combined by the decomposition action of an oxide film bas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28B23K1/00
CPCB23K35/286B23K1/00B23K35/0238B32B15/016C22C21/02B23K2101/14Y10T428/12764
Inventor 森祥基三宅秀幸吉野路英岩尾祥平江户正和杉本尚规本间伸洋山田诏悟寺本勇树外山猛敏
Owner MA ALUMINUM CORP
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