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Capacitor component

A capacitor component and capacitor technology, applied in capacitors, multilayer capacitors, fixed capacitors, etc., can solve the problems of reduced external electrodes, uneven thickness of external electrodes, and reduced reliability of MLCCs

Active Publication Date: 2021-01-05
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the thickness of the external electrodes formed by the dipping method may not be uniform, and the thickness of the external electrodes may be excessively reduced at the corners of the main body
In addition, when plating is formed on the external electrodes, the plating solution may penetrate into the main body, which may reduce the reliability of MLCC

Method used

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Embodiment Construction

[0021] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0022] These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the invention, although different, are not necessarily mutually exclusive. For example, structures, shapes, and dimensions described as examples in the embodiments in the present disclosure may be implemented in another exemplary embodiment without departing from the spirit and scope of the present disclosure. The shapes and sizes of elements in the drawings may be exaggerated for clarity of description, and the same elements will be denoted by the same reference numerals.

[0023] For clarity of description, some elements may be omitted or shown briefly, and the thickness of elements may be exaggerated to clearly represent layers and regions. It will be understood tha...

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Abstract

The present invention provides a capacitor component. The capacitor component comprises a body including a stacking unit where a dielectric layer and first and second internal electrodes facing each other are stacked in a first direction, and first and second connection units respectively disposed on both surfaces in a second direction perpendicular to the first direction of the stacking unit andelectrically connected with the first and second internal electrodes. The first and second connection units comprise: a metal layer disposed on the stacking unit; a ceramic layer disposed on the metallayer; and a connection unit coming in contact with the metal layer while penetrating the ceramic layer.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2019-0079455 filed with the Korean Intellectual Property Office on July 2, 2019, the entire disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a capacitor assembly. Background technique [0003] A multilayer ceramic capacitor (MLCC), a capacitor component, has a small size and high capacitance, and can be easily mounted. [0004] Generally, when forming the external electrodes in the MLCC, a paste including a conductive metal may be used, and a surface of the body on which the internal electrodes are exposed may be immersed in the paste. [0005] However, the thickness of the external electrodes formed by the dipping method may not be uniform, and the thickness of the external electrodes may be excessively reduced at the corners of the body. In addition, when plating is formed on the external electrodes, the plating solu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/005H01G4/008H01G4/12H01G4/232H01G4/30
CPCH01G4/005H01G4/232H01G4/30H01G4/224H01G4/1227H01G4/2325H01G2/02H01G4/012H01G4/1218H01G4/1209H01G4/302H01G4/33
Inventor 朴龙李种晧申旴澈洪奇杓
Owner SAMSUNG ELECTRO MECHANICS CO LTD